2222 139 69478 Vishay, 2222 139 69478 Datasheet - Page 3

• Manufacturer Part Number: 2222 139 69478
• Description: 4,7UF 100V 14,3X7,6X8,2 105°C 2000H
• Manufacturer: Vishay
• Series: 139 CLLr

Specifications of 2222 139 69478

• Capacitance: 4.7µF
• Voltage Rating: 100V
• Tolerance: ±20%
• Lifetime @ Temp.: 2000 Hrs @ 105°C
• Operating Temperature: -55°C ~ 105°C
• Features: General Purpose
• Ripple Current: 33mA
• Esr (equivalent Series Resistance): 27.00 Ohm
• Impedance: 11 Ohm
• Mounting Type: Surface Mount
• Package / Case: Non-Standard SMD
• Size / Dimension: 0.563" L x 0.299" W (14.30mm x 7.60mm)
• Height: 0.323" (8.20mm)
• Surface Mount Land Size: 0.563" L x 0.299" W (14.30mm x 7.60mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Spacing: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 222213969478; BC1187TR; MAL213969478E3

Table 2
MOUNTING
The capacitors are designed for automatic placement on to printed-circuit boards or hybrid circuits.
Optimum dimensions of soldering pads depend amongst others on soldering method, mounting accuracy, print lay-out and/or
adjacent components.
For recommended soldering pad dimensions, refer to Fig.3 and Table 2.
SOLDERING
Soldering conditions are defined by the curve, temperature
versus time, where the temperature is that measured on the
soldering pad during processing.
For maximum conditions of different soldering methods see
Figs 4, 5 and 6.
Any temperature versus time curve which does not exceed
the specified maximum curves may be applied.
AS A GENERAL PRINCIPLE, TEMPERATURE AND
DURATION SHALL BE THE MINIMUM NECESSARY
REQUIRED TO ENSURE GOOD SOLDERING
CONNECTIONS. HOWEVER, THE SPECIFIED MAXIMUM
CURVES SHOULD NEVER BE EXCEEDED.
Document Number: 28301
Revision: 28-May-08
RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters (placement accuracy ± 0.25 mm)
NOMINAL CASE SIZE
14.3 x 6.2 x 6.9
14.3 x 7.6 x 8.2
L x W x H
C
reflow soldering
E
B
A
F
15.8
15.8
solder land/
solder paste
pattern
Fig.3 Recommended pad dimensions for reflow and wave soldering
A
For technical questions, contact: [e-mail]
8.8
8.8
B
FOR REFLOW SOLDERING
3.5
3.5
C
SMD (Chip) Long Life
Aluminum Capacitors
solder resist
pattern
2.8
2.8
D
D G
8.0
8.0
E
Table 3
16.2
16.2
F
CURING CONDITIONS FOR SMD-GLUE
C
occupied
area
7.7
9.1
G
MAX. T
(°C)
125
140
150
160
160
18.6
18.6
A
amb
wave soldering
10.0
10.0
B
B
A
F
tracks or
dummy tracks
E
FOR WAVE SOLDERING
4.3
4.3
C
MAX. EXPOSURE TIME
5.0
6.0
D
(minutes)
8.8
8.8
E
30
10
5
2
2
139 CLL
www.vishay.com
20.5
21.5
F
Vishay
D G
11.5
13.0
G
3