292D475X9010R2T Vishay, 292D475X9010R2T Datasheet - Page 4

Tantamount, Lead Frameless Molded

292D475X9010R2T

Manufacturer Part Number
292D475X9010R2T
Description
Tantamount, Lead Frameless Molded
Manufacturer
Vishay
Series
292Dr
Datasheet

Specifications of 292D475X9010R2T

Capacitance
4.7 uF
Voltage Rating
10 Volts
Esr
5 Ohms
Tolerance
10 %
Operating Temperature Range
- 55 C to + 85 C
Package / Case
0805 (2012-12 metric)
Dimensions
1.3 mm W x 2 mm L
Height
1.2 mm
Product
Tantalum Solid Standard Grade - Other Various
Dissipation Factor Df
8
Leakage Current
0.5 uAmps
Termination Style
SMD/SMT
Lead Free Status / Rohs Status
 Details
292D
Vishay Sprague
www.vishay.com
38
ENVIRONMENTAL PERFORMANCE CHARACTERISTICS
ITEM
Life Test at + 85 °C
Humidity Tests
Thermal Shock
MECHANICAL PERFORMANCE CHARACTERISTICS
TEST CONDITION
Terminal Strength
Substrate Bending
(Board flex)
Vibration
Shock
Resistance to Solder
Heat
Solderability
Resistance to
Solvents
Flammability
Not for New Designs. See Vishay 298D Series for New Design and/or Replacements
CONDITION
1000 h application of rated voltage at
85 °C with a 3 Ω series resistance,
MIL-STD 202G Method 108A
At 40 °C/90 % RH 500 h, no voltage
applied. MIL-STD 202G Method 103B
At - 55 °C/+ 125 °C, 30 min. each,
for 5 cycles. MIL-STD 202G Method 107G
CONDITION
Apply a pressure load of 5 N for 10 ± 1 s
horizontally to the center of capacitor side body.
AECQ-200 rev. C Method 006
With parts soldered onto substrate test board,
apply force to the test board for a deflection
of 1 mm. AECQ-200 rev. C Method 005
MIL-STD-202G, Method 204D,
10 Hz to 2000 Hz, 20 G Peak
Mil-Std-202G, Method 213B, Condition I,
100G Peak
At 260 °C, for 10 s, reflow
MIL-STD-202G, Method 208H, ANSI/J-Std-002,
Test B. Applies only to Solder and tin plated
terminations. Does not apply to gold terminations.
MIL-STD-202, Method 215D
Encapsulation materials meet UL94 VO with an
oxygen index of 32 %.
For technical questions, contact:
T
ANTAMOUNT
Solid Tantalum Chip Capacitors,
®
Leadframeless Molded
tantalum@vishay.com
POST TEST PERFORMANCE
Capacitance Change
Dissipation Factor
Leakage Current
Capacitance Change
Dissipation Factor
Leakage Current
Capacitance Change
Dissipation Factor
Leakage Current
POST TEST PERFORMANCE
Capacitance Change
Dissipation Factor
Leakage Current
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Capacitance Change
Dissipation Factor
Leakage Current
Capacitance Change
Dissipation Factor
Leakage Current
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Capacitance Change
Dissipation Factor
Leakage Current
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Capacitance Change
Dissipation Factor
Leakage Current
There shall be no mechanical or visual damage to capacitors
post-conditioning.
There shall be no mechanical or visual damage to capacitors
post-conditioning.
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Not to exceed 150 % of initial
Not to exceed 150 % of initial
Not to exceed 150 % of initial
Initial specified value or less
Initial specified value or less
Initial specified value or less
Initial specified value or less
Refer to Standard Ratings Table
Not to exceed 150 % of initial
Refer to Standard Ratings Table
Not to exceed 200 % of initial
Refer to Standard Ratings Table
Not to exceed 200 % of initial
Refer to Standard Ratings Table
Not to exceed 200 % of initial
Refer to Standard Ratings Table
Initial specified value or less
Refer to Standard Ratings Table
Initial specified value or less
Refer to Standard Ratings Table
Initial specified value or less
Refer to Standard Ratings Table
Initial specified value or less
Not to exceed 200 % of initial
Document Number: 40042
Revision: 16-Sep-09

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