1885370000 Weidmuller, 1885370000 Datasheet - Page 3

• Manufacturer Part Number: 1885370000
• Description: CONN TERM BLOCK 21POS 3.5MM PCB
• Manufacturer: Weidmuller
• Series: LSF-SMTr

Specifications of 1885370000

• Terminal Block Type: Wire to Board
• Number Of Levels: 1
• Positions Per Level: 21
• Pitch: 0.138" (3.50mm)
• Mating Orientation: 45° (135°) Angle with Board
• Current: 10A
• Voltage: 300V
• Wire Gauge: 16-24 AWG
• Mounting Type: Through Hole
• Termination: Screwless - Push In
• Color: Black
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Other names: 281-2083

CSA rating data
Rated voltage (Use group D)
Rated current (Use group D)
AWG conductor (field wiring), min.
AWG conductor (field wiring), max.
UL 1059 rating data
Rated voltage (Use group D)
Rated current (Use group D)
AWG conductor, min.
AWG conductor, max.
Approvals
Approvals institutes
Classifications
eClass 5.1
Order No.
1885650000
1887340000
1885180000
1887550000
1885660000
1887350000
1885190000
1887560000
1885670000
1887360000
1885200000
1887580000
Similar products
Product catalogue | PCB connection systems | PCB terminals | PUSH IN spring connection | LSF-SMT 3.5/3.81 | LSF-
Part designation
LSF-SMT3.50/2/135 3.5
LSF-SMT3.5/2/135 3.5R
LSF-SMT3.50/2/135 1.5
LSF-SMT3.5/2/135 1.5R
LSF-SMT3.50/3/135 3.5
LSF-SMT3.5/3/135 3.5R
LSF-SMT3.50/3/135 1.5
LSF-SMT3.5/3/135 1.5R
LSF-SMT3.50/4/135 3.5
LSF-SMT3.5/4/135 3.5R
LSF-SMT3.50/4/135 1.5
LSF-SMT3.5/4/135 1.5R
- 3 -
300 V
10 A
24
16
300 V
10 A
24
16
27-26-11-01
Version
PCB terminal, Push In, Reflow solder connection, Clamping range,
max.: 1.5 mm², Pitch: 3.50 mm, No. of poles: 2, 135°, Tube
PCB terminal, Push In, Reflow solder connection, Clamping range,
max.: 1.5 mm², Pitch: 3.50 mm, No. of poles: 2, 135°, Tape
PCB terminal, Push In, Reflow solder connection, Clamping range,
max.: 1.5 mm², Pitch: 3.50 mm, No. of poles: 2, 135°, Tube
PCB terminal, Push In, Reflow solder connection, Clamping range,
max.: 1.5 mm², Pitch: 3.50 mm, No. of poles: 2, 135°, Tape
PCB terminal, Push In, Reflow solder connection, Clamping range,
max.: 1.5 mm², Pitch: 3.50 mm, No. of poles: 3, 135°, Tube
PCB terminal, Push In, Reflow solder connection, Clamping range,
max.: 1.5 mm², Pitch: 3.50 mm, No. of poles: 3, 135°, Tape
PCB terminal, Push In, Reflow solder connection, Clamping range,
max.: 1.5 mm², Pitch: 3.50 mm, No. of poles: 3, 135°, Tube
PCB terminal, Push In, Reflow solder connection, Clamping range,
max.: 1.5 mm², Pitch: 3.50 mm, No. of poles: 3, 135°, Tape
PCB terminal, Push In, Reflow solder connection, Clamping range,
max.: 1.5 mm², Pitch: 3.50 mm, No. of poles: 4, 135°, Tube
PCB terminal, Push In, Reflow solder connection, Clamping range,
max.: 1.5 mm², Pitch: 3.50 mm, No. of poles: 4, 135°, Tape
PCB terminal, Push In, Reflow solder connection, Clamping range,
max.: 1.5 mm², Pitch: 3.50 mm, No. of poles: 4, 135°, Tube
PCB terminal, Push In, Reflow solder connection, Clamping range,
max.: 1.5 mm², Pitch: 3.50 mm, No. of poles: 4, 135°, Tape
SMT 3.5/135