UPD5731T6M-E2-A CEL, UPD5731T6M-E2-A Datasheet
UPD5731T6M-E2-A
Specifications of UPD5731T6M-E2-A
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UPD5731T6M-E2-A Summary of contents
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DESCRIPTION μ The PD5731T6M is a CMOS MMIC SP4T switch which was developed for mobile communications, wireless communications and other RF switching applications. <R> This device can operate from 0.01 to 2.0 GHz, with low insertion loss and high isolation. ...
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PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) (Top View TRUTH TABLE ON-state V 1 cont INPUT−OUTPUT1 Low INPUT−OUTPUT2 Low INPUT−OUTPUT3 High INPUT−OUTPUT4 ...
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ELECTRICAL CHARACTERISTICS (T = +25° 2 pF, unless otherwise specified) Parameter Insertion Loss 1 Insertion Loss 2 Insertion Loss 3 <R> Isolation 1 Isolation 2 Isolation 3 <R> Input Return Loss 1 <R> Input ...
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EVALUATION CIRCUIT 1 000 OUTPUT1 C0 OUTPUT2 C0 Remark 000 pF Caution This IC has pull down resistance between RF line and GND, which fixes the electrical potential of RF line to 0 ...
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... ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD OUTPUT1 OUT1 OUTPUT2 OUT2 USING THE NEC EVALUATION BOARD <R> Symbol Values C2 1 000 000 pF INPUT UPD5731T6M SW SP4T CMOS Data Sheet PU10717EJ03V0DS μ PD5731T6M OUTPUT4 OUT4 cont V 1 cont OUTPUT3 OUT3 5 ...
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TYPICAL CHARACTERISTICS (T = +25° 2 pF, unless otherwise specified) INSERTION LOSS vs. FREQUENCY 0 –0.5 –1.0 –1.5 –2.0 INPUT-OUTPUT1 ON-State INPUT-OUTPUT2 ON-State –2.5 INPUT-OUTPUT3 ON-State INPUT-OUTPUT4 ON-State –3.0 0 0.5 1.0 Frequency ...
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INPUT RETURN LOSS vs. FREQUENCY 0 –10 –20 –30 –40 INPUT-OUTPUT1 ON-State INPUT-OUTPUT2 ON-State –50 INPUT-OUTPUT3 ON-State INPUT-OUTPUT4 ON-State –60 0 0.5 1.0 1.5 Frequency f (GHz) OUTPUT POWER vs. INPUT POWER 21 P (INPUT-OUTPUT1) out 20 P (INPUT-OUTPUT2) out ...
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MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS 12-PIN PLASTIC TSQFN (T6M) (UNIT: mm) Remark The mounting pad and solder mask layouts in this document are for reference only. 8 MOUNTING PAD 1.15 1.15 0.77 0.77 0.5 0.5 0.94 SOLDER MASK ...
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PACKAGE DIMENSIONS 12-PIN PLASTIC TSQFN (T6M) (UNIT: mm) (C 0.17) 0.23±0.1 Remark A > Reference value 2.0±0.1 (Bottom View) 0.50±0.06 0.94±0.1 Data Sheet PU10717EJ03V0DS μ PD5731T6M +0.03 0.37 –0.05 9 ...
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RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Peak temperature (package surface temperature) Time at ...
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The information in this document is current as of December, 2008. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most ...