B32676G8685K EPCOS Inc, B32676G8685K Datasheet - Page 16
![Film Cap 6,8000uF 10% 875V- MKP BOX](/photos/27/89/278906/b32676e3655k_sml.jpg)
B32676G8685K
Manufacturer Part Number
B32676G8685K
Description
Film Cap 6,8000uF 10% 875V- MKP BOX
Manufacturer
EPCOS Inc
Series
MKP B32676r
Datasheet
1.B32674D8474K.pdf
(32 pages)
Specifications of B32676G8685K
Capacitance
6.8µF
Voltage - Ac
400V
Voltage - Dc
875V
Dielectric Material
Polypropylene, Metallized
Tolerance
±10%
Operating Temperature
-40°C ~ 105°C
Mounting Type
Through Hole
Package / Case
Radial
Size / Dimension
1.654" L x 1.102" W (42.00mm x 28.00mm)
Height
1.673" (42.50mm)
Termination
PC Pins
Lead Spacing
1.476" (37.50mm)
Features
AC and Pulse
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Esr (equivalent Series Resistance)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
495-3031
B32676C8685K
B32676C8685K
3
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Embedding of capacitors in finished assemblies
B32674 ... B32678
MKP DC link
high power series
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