ACMD-7605-BLK Avago Technologies US Inc., ACMD-7605-BLK Datasheet - Page 8

• Manufacturer Part Number: ACMD-7605-BLK
• Description: Fiber Optic Transmitters, Receivers, Transceivers FBAR Duplexer
• Manufacturer: Avago Technologies US Inc.
• Series: -r

Specifications of ACMD-7605-BLK

• Frequency Bands (low / High): 880MHz ~ 915MHz, 925MHz ~ 960MHz
• Low Band Attenuation (min / Max Db): 30.00dB / -
• High Band Attenuation (min / Max Db): 45.00dB / -
• Return Loss (low Band / High Band): 13.8dB / 17.3dB
• Mounting Type: Surface Mount
• Package / Case: 3-CSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

0.25
0.35
Figure 19. PCB Layout (top view).
A PCB layout using the principles illustrated in Figure
15 is recommended to optimize performance of the
ACMD-7605.
It is important to maximize isolation between the Tx con-
nection to the duplexer and the Rx port. High isolation is
achieved by: (1) maintaining a continuous ground plane
around the duplexer mounting area, and (2) surrounding
the I/O ports with sufficient ground vias to enclose the
connections in a “Faraday cage. ”
8
0.30
G
G
Tx
0.35
0.25
0.30
2.10
Ant
Rx
Depending on trace routing beyond the immediate vicinity
of the duplexer, it may be advisable to place the Rx (Tx)
trace in a different metal layer than the Rx (Tx). Having the
Tx and Rx traces in different layers helps prevent leakage
of the Tx signal into other components that could result
in the creation of intermodulation products and degrada-
tion of overall system performance.
A sufficient number of vias should be used to ensure
excellent RF grounding as well as good heat sinking for
the device.
Note: It is not necessary to void the PCB ground plane under the metal
void shown in Fig 13.
Ø 0.30 VIA ARRAY
HORIZ PITCH = 0.40
VERT PITCH = 0.40
2.28
Notes:
1. Dimensions in mm
2. Transmission line Gap (G) adjusted for Zo =
3. I/O Pads (3 ea) 0.35 X 0.35, corner chamfer
4. Ground vias positioned to maximize port-
5. Tx connection on optionally placed in
50 ohms
0.03
to-port isolation
buried metal layer