HSDL-3201#021 Lite-On Electronics, HSDL-3201#021 Datasheet - Page 12
HSDL-3201#021
Manufacturer Part Number
HSDL-3201#021
Description
Infrared Transceivers IR Transceiver 115.2Kb/s
Manufacturer
Lite-On Electronics
Type
TX/RXr
Datasheet
1.HSDL-3201021.pdf
(20 pages)
Specifications of HSDL-3201#021
Wavelength
875 nm, 880 nm
Continual Data Transmission
115.2 Kbit/s
Transmission Distance
30 cm
Radiant Intensity
9 mW/sr
Half Intensity Angle Degrees
30 deg to 60 deg
Pulse Width
2.45 us, 1.6 us
Maximum Rise Time
120 ns, 600 ns
Maximum Fall Time
80 ns, 600 ns
Led Supply Voltage
2.7 V to 6 V
Operating Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 25 C
Dimensions
8 mm x 3 mm x 2.5 mm
Data Rate
115.2Kbps
Peak Wavelength
875/880nm
Angle Of Half Sensitivity
60/30°
Communication Distance
30
Package Type
Ultra Small Profile
Fall Time
600/25ns
Rise Time
600/20ns
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Mounting
Surface Mount
Pin Count
8
Operating Temp Range
-25C to 85C
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Appendix A: HSDL-3201#021
SMT Assembly Application Note
Solder Pad, Mask, and Metal Stencil
Recommended Metal Solder
Stencil Aperture
It is recommended that only a 0.127
mm (0.005 inches) or a 0.11 mm (0.004
inches) thick stencil be used for solder
paste printing. This is to ensure
adequate printed solder paste volume
and no shorting. See the table below
the drawing for combinations of metal
stencil aperture and metal stencil
thickness that should be used.
Aperture opening for shield pad is 2.7
mm x 1.25 mm as per land pattern.
12
APERTURE
STENCIL
SOLDER
MASK
Stencil Thickness, t (mm)
0.127 mm
0.11 mm
LAND
PATTERN
l
APERTURES AS PER
LAND DIMENSIONS
METAL STENCIL
FOR SOLDER PASTE
PRINTING
PCB
length, l
1.75
2.4
0.05
0.05
Aperture Size (mm)
w
width, w
0.55
0.55
0.05
0.05
t