TFDU4100-TT3 Vishay, TFDU4100-TT3 Datasheet

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TFDU4100-TT3

Manufacturer Part Number
TFDU4100-TT3
Description
Infrared Transceivers SIR 115.2kbits TOP VIEW
Manufacturer
Vishay
Datasheet

Specifications of TFDU4100-TT3

Wavelength
900 nm
Continual Data Transmission
115.2 Kbit/s
Radiant Intensity
140 mW/sr
Half Intensity Angle Degrees
48 deg
Pulse Width
4 us
Maximum Rise Time
200 ns, 600 ns
Maximum Fall Time
200 ns, 600 ns
Led Supply Voltage
- 0.5 V to 6 V
Maximum Forward Current
100 mA
Operating Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 25 C
Dimensions
9.7 mm x 4.7 mm x 4 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Description
The TFDU4100, TFDS4500, and TFDT4500 are a family
of low-power infrared transceiver modules compliant to
the IrDA 1.2 standard for serial infrared (SIR) data
communication, supporting IrDA speeds up to 115.2
kbit/s. Integrated within the transceiver modules are a
photo PIN diode, infrared emitter (IRED), and a
low-power analog control IC to provide a total front–end
solution in a single package. TEMIC’s SIR transceivers
are available in three package options, including our
BabyFace package (TFDU4100), the smallest SIR
transceiver available on the market. This wide selection
Package Options
This product is currently in devleopment. Inquiries regarding the status of this product should be directed to TEMIC Marketing.
TELEFUNKEN
Semiconductor
2.7–5.5V Serial Infrared Transceiver Module Family
(SIR, 115.2 kbit/s)
Pending—Rev. A, 03-Apr-98
Features
D
D
D
D
D
D
Compliant to IrDA 1.2 (up to
115.2 kbit/s)
Wide Operating Voltage Range
(2.7 to 5.5 V )
Low Power Consumption
(1.3 mA Supply Current)
Power Sleep Mode Through
V
Current)
Long Range (up to 3.0 m at 115.2
kbit/s)
Three Surface Mount Package
Options
CC1
Universal (9.7 x 4.7 x 4.0 mm)
Side View (13.0 x 5.95 x 5.3 mm)
Top View (13.0 x 7.6 x 5.95 mm)
Baby Face (Universal)
/SD Pin (5 nA Sleep
TFDU4100
TFDU4100/TFDS4500/TFDT4500
D
D
D
D
D
Pre-Release Information
BabyFace (Universal) Package
Capable of Surface Mount
Solderability to Side- and
Top-View Orientation
Directly Interfaces with Various
Super I/O and Controller Devices
and TEMIC’s TOIM3000 and
TOIM3232 I/Os
Few External Components
Required
Backward Compatible to All
TEMIC SIR Infrared
Transceivers
Built–in EMI Protection – No
External Shielding Necessary
TFDS4500
Side View
provides flexibility for a variety of applications and space
constraints.
The transceivers are capable of directly interfacing with
a wide variety of I/O chips which perform the pulse-width
modulation/demodulation function, including TEMIC’s
TOIM3000 and TOIM3232.
current-limiting resistor in series with the infrared emitter
and a Vcc bypass capacitor are the only external
components required to implement a complete solution.
Applications
D
D
D
D
D
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Notebook Computers, Desktop
PCs, Palmtop Computers (Win
CE, Palm PC), PDAs
Digital Still and Video Cameras
Printers, Fax Machines,
Photocopiers, Screen Projectors
Telecommunication Products
(Cellular Phones, Pagers)
Internet TV Boxes, Video
conferencing systems
External Infrared Adapters
(Dongles)
Medical and Industrial Data
Collection Devices
TFDT4500
Top View
At a minimum, a
1

Related parts for TFDU4100-TT3

TFDU4100-TT3 Summary of contents

Page 1

... Top View (13.0 x 7.6 x 5.95 mm) – Description The TFDU4100, TFDS4500, and TFDT4500 are a family of low-power infrared transceiver modules compliant to the IrDA 1.2 standard for serial infrared (SIR) data communication, supporting IrDA speeds up to 115.2 kbit/s. Integrated within the transceiver modules are a photo PIN diode, infrared emitter (IRED), and a low-power analog control IC to provide a total front– ...

Page 2

... TFDU4100/TFDS4500/TFDT4500 Functional Block Diagram Amplifier AGC Logic SC Txd Open Collector Driver Pin Assignment and Description Pin Number “ U ”, “ T ” “ S ” Function Option Option 1 8 IRED Anode IRED anode, should be externally connected to V control resistor 2 1 IRED Cathode IRED cathode, internally connected to driver transistor ...

Page 3

... TELEFUNKEN TFDU4100/TFDS4500/TFDT4500 Semiconductor Ordering Information Part Number Qty/ Reel TFDU4100–TR3 1000 pcs TFDU4100–TT3 1000 pcs TFDS4500–TR3 750 pcs TFDT4500–TR3 750 pcs Absolute Maximum Ratings Parameter Supply Voltage Range Voltage Range of IRED Drive Output d Input Currents Output Sink Current ...

Page 4

... TFDU4100/TFDS4500/TFDT4500 Electrical Characteristics Parameter Symbol Transceiver Supply Voltage V Supply Voltage V Supply Current Pin CC1 CC1 (Receive Mode) Supply Current Pin (avg CC1 CC1 d d (Transmit Mode) Leakage Current of IR Emitter, IRED Anode Pin Transceiver Power On Settling Time Optoelectronic Characteristics Parameter Symbol ...

Page 5

... TELEFUNKEN TFDU4100/TFDS4500/TFDT4500 Semiconductor Optoelectronic Characteristics (Cont’d) Parameter Symbol Transmitter d IRED Operating Current I Logic Low Transmitter Input Voltage Logic High Transmitter Input Voltage Output Radiant Intensity I eH Output Radiant Intensity I eL Angle of Half Intensity Peak Wavelength of Emission Halfwidth of Emission Spectrum Optical Rise Time, Fall Time ...

Page 6

... TFDU4100/TFDS4500/TFDT4500 unstable power supply with dropping voltage during transmission may reduce sensitivity (and transmission range) of the transceiver. Table 1. Recommended Application Circuit Components Component Recommended Value C1 100 nF, Ceramic (use 470 nF for less stable power supplies Tantalum R1 8.2 , 0.25 W (recommend using two 0.125 W ...

Page 7

... Pending—Rev. A, 03-Apr-98 I IRED TFDU4100 (Note: Typical Values Listed) Receive Mode @ @2 ILIM Transmit Mode @ @2 IRED Anode /SD CC1 Figure 3. I IRED TFDU4100 (Note: Typical Values Listed) Receive Mode @ @2 Transmit Mode @ @2 IRED Anode /SD CC1 Figure 4. Pre-Release Information = 300 mA 1.3 mA IRED S = 300 mA 1.0 mA ...

Page 8

... TFDU4100/TFDS4500/TFDT4500 TFDU4100 – BabyFace (Universal) Package Mechanical Dimensions 8 Pre-Release Information TELEFUNKEN Semiconductor Pending—Rev. A, 03-Apr-98 ...

Page 9

... TELEFUNKEN TFDU4100/TFDS4500/TFDT4500 Semiconductor TFDS4500 – Side View Package Mechanical Dimensions TK84 731 TFDS 4500 Pending—Rev. A, 03-Apr-98 Pre-Release Information 9 ...

Page 10

... TFDU4100/TFDS4500/TFDT4500 TFDT4500 – Top View Package Mechanical Dimensions TK84 731 TFDS 4500 10 Pre-Release Information TELEFUNKEN Semiconductor Pending—Rev. A, 03-Apr-98 ...

Page 11

... TELEFUNKEN TFDU4100/TFDS4500/TFDT4500 Semiconductor Recommended SMD Pad Layout TFDU4100 BabyFace (Universal) Package TFDS4500 Side View Package a. The leads of the device should be soldered in the center position. Pending—Rev. A, 03-Apr-98 a TFDT4500 Top View Package (note: leads of the device should be at least 0.3 mm within the ends of the pads. Pad 1 is longer to ...

Page 12

... TFDU4100/TFDS4500/TFDT4500 Recommended Solder Profile 260 240 220 200 180 160 _ 140 120 100 80 2 – 4 _C/Seconds Current Derating Curve 600 500 400 300 Current derating as a function of the maximum forward current of IRED. 200 Maximum duty cycle: 20% 100 0 –40 –20 12 Pre-Release Information 2 – ...

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