HSDL-3209-021 Lite-On Electronics, HSDL-3209-021 Datasheet - Page 12

• Manufacturer Part Number: HSDL-3209-021
• Description: Infrared Transceivers IR Transceiver 115Kb/s
• Manufacturer: Lite-On Electronics

Specifications of HSDL-3209-021

• Wavelength: 875 nm, 880 nm
• Continual Data Transmission: 115.2 Kbit/s
• Radiant Intensity: 14 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 4 ms, 1.6 ms
• Maximum Rise Time: 60 ns, 600 ns
• Maximum Fall Time: 60 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Maximum Forward Current: 50 mA
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 7 mm x 2.8 mm x 1.6 mm
• Data Rate: 115.2kbs (SIR)
• Idle Current, Typ @ 25° C: 100µA
• Link Range, Low Power: 30cm
• Operating Temperature: -25°C ~ 70°C
• Orientation: Side View
• Shutdown: *
• Size: 7mm x 2.8mm x 1.6mm
• Standards: IrPHY 1.4
• Supply Voltage: 2.4 V ~ 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Appendix B: PCB Layout Suggestion
The HSDL 3209 is a shieldless part and hence does not
contain a shield trace unlike the other transceivers. The
following PCB layout guidelines should be followed to
obtain a good PSRR and EM immunity resulting in good
electrical performance. Things to note:
1. The ground plane should be continuous under the
2. VLED can be connected to either unfiltered or unreg-
The area underneath the module at the second layer, and
3cm in all direction around the module is defined as the
critical ground plane zone. The ground plane should be
maximized in this zone. Refer to application note AN1114
or the Lite-On Technology IrDA Data Link Design Guide
for details. The layout below is based on a 2-layer PCB.
1
part.
ulated power supply. If VLED and Vcc share the same
power supply, CX3 need not be used and the connec-
tions for CX1 and CX2 should be before the current
limiting resistor R1. CX1 is generally a ceramic capaci-
Top layer
Connect the metal shield & module
ground pin to bottom ground layer
Layer 2
Critical ground plane zone. Do not connect
directly to the module ground pin
Layer 3
Keep data bus away from critical ground
plane zone
Bottom layer
(GND)
3. Preferably a multi-layered board should be used to
tor of low inductance providing a wide frequency
response while CX2 and CX3 are tantalum capacitors
of big volume and fast frequency response. The use
of a tantalum capacitor is more critical on the VLED
line, which carries a high current. CX4 is an optional
ceramic capacitor, similar to CX1, for the IOVcc line.
provide sufficient ground plane. Use the layer un-
derneath and near the transceiver module as Vcc,
and sandwich that layer between ground connected
board layers. Refer to the diagram below for an ex-
ample of a 4 layer board,
Top View
Bottom View