TFDU5307-TT1 Vishay, TFDU5307-TT1 Datasheet - Page 9

• Manufacturer Part Number: TFDU5307-TT1
• Description: Infrared Transceivers MIR 1.152 Mbits Infrared
• Manufacturer: Vishay
• Type: TX/RXr

Specifications of TFDU5307-TT1

• Wavelength: 900 nm
• Continual Data Transmission: 1.152 Mbit/s
• Radiant Intensity: 120 mW/sr
• Half Intensity Angle Degrees: 48 deg
• Pulse Width: 2 us
• Maximum Rise Time: 60 ns, 40 ns
• Maximum Fall Time: 60 ns, 40 ns
• Led Supply Voltage: - 0.5 V to 6.5 V
• Operating Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 8.5 mm x 2.9 mm x 2.5 mm
• Data Rate: 0.001152kbps
• Peak Wavelength: 900nm
• Angle Of Half Sensitivity: 48°
• Fall Time: 40/60ns
• Rise Time: 40/60ns
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 5.5V
• Mounting: Surface Mount
• Pin Count: 8
• Operating Temp Range: -25C to 85C
• Operating Temperature Classification: Commercial
• Idle Current, Typ @ 25° C: 550µA
• Link Range, Low Power: 70cm
• Operating Temperature: -30°C ~ 85°C
• Orientation: Top View
• Shutdown: *
• Size: 8.5mm x 2.9mm x 2.5mm
• Standards: IrPHY 1.4
• Supply Voltage: 2.7 V ~ 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

TFDU5307
Vishay Semiconductors
Table 2.
Truth table
Recommended Solder Profiles
Solder Profile for Sn/Pb Soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFDU5307 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead (Pb)-
free solder paste like Sn (3.0 - 4.0) Ag (0.5 - 0.9) Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in
figure 4 and 5 are VISHAY's recommended profiles
for use with the TFDU5307 transceivers. For more
www.vishay.com
250
< 600 µs
> 1.5 ms
19535
Figure 3. Recommended Solder Profile for Sn/Pb soldering
260
240
220
200
180
160
140
120
100
high
high
low
80
60
40
20
SD
0
0
2...4 °C/s
> 80 ms
50
TXD
high
high
low
low
low
x
x
100
Optical input Irradiance mW/m
160 °C max.
Inputs
120 s...180 s
240 °C max.
150
< Maximum irradiance E
> Maximum irradiance E
Time/s
> Minimum irradiance E
200
2...4 °C/s
< 4
x
x
x
x
10 s max. at 230 °C
90 s max.
250
300
e
e
e
2
350
(500 kΩ) to V
(500 kΩ) to V
weakly pulled
weakly pulled
high inactive
high inactive
low (active)
low (active)
undefined
details please refer to the application note
“SMD Assembly Instructions”
(http://www.vishay.com/docs/82602/82602.pdf).
A ramp-up rate less than 0.9 °C/s is not recom-
mended. Ramp-up rates faster than 1.3 °C/s could
damage an optical part because the thermal conduc-
tivity is less than compared to a standard IC.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be rec-
ommended because the risk of damage is highly
dependent on the experience of the operator. Never-
theless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equiva-
lent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
RXD
Outputs
CC1
CC1
Transmitter
I
0
0
0
0
0
0
e
Ignoring low signals below the IrDA
Time window for pulse duration
Response to an IrDA compliant
Overload conditions can cause
defined threshold for noise
unexpected outputs
Protection is active
optical input signal
Document Number 82616
Transmitting
Operation
Shutdown
immunity
Remark
setting
Rev. 1.6, 02-Mar-07