HSDL-3602-008 Lite-On Electronics, HSDL-3602-008 Datasheet - Page 16

Infrared Transceivers IR Transceiver

HSDL-3602-008

Manufacturer Part Number
HSDL-3602-008
Description
Infrared Transceivers IR Transceiver
Manufacturer
Lite-On Electronics
Datasheet

Specifications of HSDL-3602-008

Wavelength
875 nm, 880 nm
Continual Data Transmission
4 Mbit/s
Transmission Distance
1.5 m
Radiant Intensity
250 mW/sr
Half Intensity Angle Degrees
30 deg to 60 deg
Pulse Width
4 us, 1.6 us
Maximum Rise Time
40 ns, 25 ns
Maximum Fall Time
40 ns, 25 ns
Led Supply Voltage
- 0.5 V to 7 V
Maximum Forward Current
165 mA
Operating Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
- 20 C
Dimensions
12.2 mm x 4.9 mm x 4 mm
Data Rate
4Mbs (FIR)
Idle Current, Typ @ 25° C
2.5mA
Link Range, Low Power
1m
Operating Temperature
-20°C ~ 70°C
Orientation
Top View
Shutdown
*
Size
12.2mm x 4.9mm x 4mm
Standards
IrPHY 1.4
Supply Voltage
2.7 V ~ 3.6 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HSDL-3602-008
Manufacturer:
HP
Quantity:
500
Company:
Part Number:
HSDL-3602-008
Quantity:
602
16
3.0. Pick and Place Misalignment Tolerance and Product
Self-Alignment after Solder Reflow
If the printed solder paste volume is adequate, the
unit will self-align in the X-direction after solder reflow.
Units should be properly reflowed in IR Hot Air convec-
tion oven using the recommended reflow profile. The
direction of board travel does not matter.
2.0. Recommended solder paste/cream volume for castel-
lation joints
Based on calculation and experiment, the printed sol-
der paste volume required per castellation pad is 0.30
cubic mm (based on either no-clean or aqueous solder
cream types with typically 60 to 65% solid content by
volume).
Figure 4. Solder paste stencil aperture.
See Figure 4
w, the width of aperture is fixed at 0.70 mm (0.028 inches)
Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimension.
l
SOLDER
PASTE
mm
0.152
0.127
t, nominal stencil thickness
HSDL-3602 fig 4.0
inches
0.006
0.005
APERTURE AS PER
LAND
w
t (STENCIL THICKNESS)
2.1. Recommended Metal Solder Stencil Aperture
It is recommended that only 0.152 mm (0.006 inches) or
0.127 mm (0.005 inches) thick stencil be used for solder
paste printing. This is to ensure adequate printed solder
paste volume and no shorting. The following combina-
tion of metal stencil aperture and metal stencil thick-
ness should be used:
Allowable Misalignment Tolerance
X-direction
Theta-direction
l, length of aperture
mm
2.8 ± 0.05
3.4 ± 0.05
≤ 0.2 mm (0.008 inches)
± 2 degrees
inches
0.110 ± 0.002
0.134 ± 0.002

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