CM201212-R33KL Bourns Inc., CM201212-R33KL Datasheet - Page 2

• Manufacturer Part Number: CM201212-R33KL
• Description: Inductor,Wirewound,330mH,10+% Tol,10-% Tol,0805-Case
• Manufacturer: Bourns Inc.

Specifications of CM201212-R33KL

• Inductance: 330 nH
• Termination Style: SMD/SMT
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

CM10, CM16, CM20, CM25, CM32
Specifications are subject to change without notice.
Model
CM10
CM16
CM20
CM25
CM32
CM45
Packaging Specifications
Reel Dimensions
Soldering
Flow Soldering
Packaging
t1
Model
CM10
CM16
CM20
Flow Soldering
CM10
CM16
CM20
CM25
CM32
CM45
Model
Vapor-phase
t2
Infra-red
CM45, CM32, CM25, CM20, CM16, CM10 SMT Chip Inductors
Preheat:
100 to 150°
2 minutes
min.
0.71 (.027) 1.21 (.047) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 0.60 (.024) 0.27 (.011)
1.00 (.039) 1.80 (.071) 8.00(.315)
1.45 (.057) 2.25 (.089) 8.00(.315)
2.40 (.094) 2.90 (.114) 8.00(.315)
2.80 (.110) 3.60 (.142) 8.00(.315)
3.60 (.142) 4.90 (.193) 12.00(.472) 5.50 (.217) 1.75 (.069) 8.00 (.315) 2.00 (.079) 4.00 (.157) 1.50 (.059)
A
W
178 (7.008)
178 (7.008)
178 (7.008)
178 (7.008)
178 (7.008)
178 (7.008)
Chip
Component
10000 pcs
E
Quantity
3000 pcs
3000 pcs
10 seconds max.
F
A
260°C maximum for 5 seconds (2 wave solder method)
200°C for a maximum of 30 seconds. Peak of 240°C for a maximum of 5 seconds.
If the solder does not reflow simultaneously under each terminal, there may be a misalignment of the component on the
board. For this reason, it is recommended that the inductor be adhered to the board prior to reflow.
215°C for a maximum of 30 seconds.
B
260°C
60 min. 13 (.512) 21 (.827)
60 min. 13 (.512) 21 (.827)
60 min. 13 (.512) 21 (.827)
60 min. 13 (.512) 21 (.827)
60 min. 13 (.512) 21 (.827)
60 min. 13 (.512) 21 (.827)
flDo
DIA.
B
D1
P1
Weight
150g
90g
90g
W
P2
Tape running direction
C
P3
3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 0.60 (.024) 0.27 (.011)
3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 1.00 (.039) 0.25 (.010)
3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 1.10 (.043) 0.25 (.010)
3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059)
F
A
Infra-red Soldering
D
Model
CM25
CM32
CM45
E
Preheat:
100 to 150°
2 minutes
min.
2 (.079)
2 (.079)
2 (.079)
2 (.079)
2 (.079)
2 (.079) 13 (.512)
B
E
Quantity
2000 pcs
2000 pcs
500 pcs
10 seconds max.
30 seconds max.
P1
9 (.354)
9 (.354)
9 (.354)
9 (.354)
9 (.354)
W
CM45
230°C
t1
200°C
t2
P2
Weight
100g
190g
100g
Chip
Component
W
E
P3
F
øD0
Vapor-phase Soldering
flDo
P1
A
Preheat:
100 to 150°
2 minutes
min.
P2
øD1
Tape running direction
—
—
10 seconds max.
30 seconds max.
P3
E
0.25 (.010)
0.30 (.012)
220°C
C
t1
A
D
215°C
1.20 (.047)
1.20 (.047)
1.55 (.061)
1.85 (.073)
2.40 (.094)
3.50 (.138)
B
t2
W
B