CRCW04025R62FKED Vishay, CRCW04025R62FKED Datasheet - Page 6
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CRCW04025R62FKED
Manufacturer Part Number
CRCW04025R62FKED
Description
D10/CRCW0402 100 5R62 1% ET7 E3
Manufacturer
Vishay
Series
CRCWr
Type
Thick Filmr
Specifications of CRCW04025R62FKED
Resistance (ohms)
5.62
Power (watts)
0.063W, 1/16W
Composition
Thick Film
Temperature Coefficient
±100ppm/°C
Tolerance
±1%
Size / Dimension
0.039" L x 0.020" W (1.00mm x 0.50mm)
Height
0.014" (0.35mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
0402 (1005 Metric)
Resistance In Ohms
5.62
Case
0402 (1005 metric)
Power Rating(s)
1/16W
Resistance
5.62Ohm
Tolerance (+ Or -)
1%
Mounting Style
Surface Mount
Operating Temp Range
-55C to 155C
Case Style
Molded
Military Standard
Not Required
Failure Rate
Not Required
Product Length (mm)
1mm
Product Depth (mm)
0.5mm
Product Height (mm)
0.35mm
Power Rating
0.063 Watt
Termination Style
SMD/SMT
Voltage Rating
50 Volts
Operating Temperature Range
- 55 C to + 155 C
Dimensions
0.5 mm W x 1 mm L x 0.35 mm H
Product
Thick Film Resistors SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Details
Other names
541-5.62LLTR
D/CRCW e3
Vishay
www.vishay.com
130
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
4.5
4.7
4.13
4.17.2
4.8.4.2
4.32
4.33
4.19
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
4.25.1
METHOD
60068-2
21 (Uu
21 (Uu
14 (Na)
30 (Db)
30 (Db)
58 (Td)
13 (M)
2 (Ba)
1 (Aa)
TEST
IEC
-
-
-
-
-
-
-
3
1
)
)
Short time overload
Substrate bending
Climatic sequence:
Rapid change of
Damp heat, cyclic
Damp heat, cyclic
Low air pressure
Voltage proof
Temperature
Solderability
temperature
Resistance
Endurance
(adhesion)
coefficient
DC load
at 70 °C
Dry heat
Shear
TEST
Cold
For technical questions, contact:
Standard Thick Film Chip Resistors
Stability for product types:
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
This datasheet is subject to change without notice.
1 kPa; (25 ± 10) °C; 1 h
U =
duration: Acc. to style
Solder bath method;
Solder bath method;
U = 2.5 x
(20/- 55/20) C and
U = 1.4 x U
non activated flux;
non-activated flux;
30 min. at - 55 °C;
55 °C; 90 % RH;
55 °C; 90 % RH;
1.5 h on; 0.5 h off;
30 min. at 125 °C
Sn96.5Ag3Cu0.5
(20/125/20) C
PROCEDURE
U =
24 h; 5 cycles
70 °C; 1000 h
70 °C; 8000 h
Depth 2 mm;
125 °C; 16 h
24 h; 1 cycle
(235 ± 5) °C
(245 ± 5) C
1000 cycles
2 x U
- 55 °C; 2 h
P
Sn60Pb40
(2 ± 0.2) s
(3 ± 0.3) s
5 cycles
70
3 times
P
x R
D/CRCW e3
-
-
70
P
max.
ins
70
x R
U
; 60 s
;
x R
max.
;
thickfilmchip@vishay.com
±0.25 % R + 0.05)
± (0.25 % R + 0.05 )
± (1 % R + 0.05 )
± (1 % R + 0.05 )
± (1 % R + 0.05 )
± (2 % R + 0.1 )
No visible damage, no open circuit in bent position
OR BETTER
± 100 ppm/K
STABILITY
CLASS 1
± 1 %
PERMISSIBLE CHANGE (R)
Good tinning ( 95 % covered)
Good tinning ( 95 % covered)
No flashover or breakdown
± (0.25 % R + 0.05 )
SIZE 0402 to 2512
No visible damage
REQUIREMENTS
no visible damage
no visible damage
1 to 10 M
± (0.5 % R + 0.05 )
±0.5 % R + 0.05)
Document Number: 20035
www.vishay.com/doc?91000
± (1 % R + 0.05 )
± (2 % R + 0.1 )
± (2 % R + 0.1 )
± (4 % R + 0.1 )
OR BETTER
± 200 ppm/K
STABILITY
CLASS 2
Revision: 08-Mar-11
± 5 %