CRCW121043K0FKTA Vishay, CRCW121043K0FKTA Datasheet - Page 6
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CRCW121043K0FKTA
Manufacturer Part Number
CRCW121043K0FKTA
Description
CRCW1210 100 43K 1% RT1
Manufacturer
Vishay
Series
CRCWr
Datasheet
1.CRCW0603100KJNEA.pdf
(8 pages)
Specifications of CRCW121043K0FKTA
Resistance (ohms)
43K
Power (watts)
0.5W, 1/2W
Composition
Thick Film
Temperature Coefficient
±100ppm/°C
Tolerance
±1%
Size / Dimension
0.126" L x 0.098" W (3.20mm x 2.50mm)
Height
0.022" (0.55mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
1210 (3225 Metric)
Resistance In Ohms
43.0K
Case
1210 (3225 metric)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Document Number: 20008
Revision: 18-Nov-10
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
4.5
4.7
4.13
4.17.2
4.8.4.2
4.32
4.33
4.19
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
4.25.1
4.18.2
4.35
4.24
4.25.3
4.40
4.29
4.30
METHOD
78 (Cab)
60082-2
21 (Uu
21 (Uu
45 (XA)
45 (XA)
58 (Td)
14 (Na)
30 (Db)
30 (Db)
58 (Td)
13 (M)
2 (Ba)
1 (Aa)
TEST
IEC
-
-
-
-
-
-
-
-
-
-
3)
1)
Component solvent resistance
Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors
Solvent resistance of marking
Rapid change of temperature
Flamability, needle flame test
Resistance to soldering heat
Damp heat, steady state
Temperature coefficient
Electrostatic discharge
category temperature
(human body model)
Endurance at upper
Short time overload
Endurance at 70 °C
Substrate bending
Climatic sequence:
Shear (adhesion)
Damp heat, cyclic
Damp heat, cyclic
Low air pressure
Voltage proof
Solderability
Resistance
DC load
Dry heat
TEST
Cold
For technical questions, contact:
Stability for product types:
Solder bath method; Sn60Pb40;
U = 2.5 x
ESD test voltage acc. to size
50 °C; method 1, toothbrush
3 pos. + 3 neg. discharges;
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
(235 ± 5) °C, (2 ± 0.2) s
1 kPa; (25 ± 10) °C; 1 h
(93 ± 3) % RH; 56 days
(260 ± 5) °C; (10 ± 1) s
U = √(P
duration: Acc. to style
Depth 2 mm; 3 times
Solder bath method
(20/- 55/20) °C and
55 °C; ≥ 90 % RH;
55 °C; ≥ 90 % RH;
U = 1.4 · U
non-activated flux;
30 min. at - 55 °C;
1.5 h on; 0.5 h off;
Isopropyl alcohol;
Isopropyl alcohol;
30 min. at 125°C
IEC 60695-11-5;
50 °C; method 2
155 °C; 1000 h
IEC 61340-3-1;
(20/125/20) °C
PROCEDURE
U =
24 h; 5 cycles
70 °C; 1000 h
70 °C; 8000 h
24 h; 1 cycle
125 °C; 16 h
1000 cycles
- 55 °C; 2 h
(40 ± 2) °C;
P
5 cycles
70
70
10 s
P
x R) ≤ U
-
-
x R
thickfilmchip@vishay.com
70
ins;
x R
≤ 2 x U
60 s
D/CRCW
max.
max.
;
STABILITY CLASS 1
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
Good tinning (≥ 95 %
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
no visible damage
± (2 % R + 0.1 Ω)
1 Ω to 10 MΩ
OR BETTER
± 100 ppm/K
REQUIREMENTS PERMISSIBLE
covered);
± 1 %
no open circuit in bent position
No flashover or breakdown
± (0.25 % R + 0.05 Ω)
No burning after 30 s
No visible damage,
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
No visible damage
No visible damage
no visible damage
Marking legible,
CHANGE (ΔR)
STABILITY CLASS 2
± (0.5 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (2 % R + 0.1 Ω)
± (2 % R + 0.1 Ω)
± (4 % R + 0.1 Ω)
± (2 % R + 0.1 Ω)
1 Ω to 10 MΩ
OR BETTER
± 200 ppm/K
D/CRCW
www.vishay.com
± 5 %
Vishay
123