H11L3FR2M Fairchild Semiconductor, H11L3FR2M Datasheet - Page 7

• Manufacturer Part Number: H11L3FR2M
• Description: High Speed Optocouplers Optocoupler
• Manufacturer: Fairchild Semiconductor

Specifications of H11L3FR2M

• Isolation Voltage: 5300 Vrms
• Maximum Continuous Output Current: 50 mA
• Maximum Fall Time: 0.1 us
• Maximum Forward Diode Current: 60 mA
• Maximum Rise Time: 0.1 us
• Output Device: Logic Gate Photo IC
• Configuration: 1 Channel
• Maximum Baud Rate: 1 MBps
• Maximum Forward Diode Voltage: 1.5 V
• Maximum Reverse Diode Voltage: 6 V
• Maximum Power Dissipation: 250 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Package / Case: PDIP-6
• Number Of Elements: 1
• Input Type: DC
• Output Type: Open Collector
• Forward Voltage: 1.5V
• Forward Current: 60mA
• Output Current: 50mA
• Package Type: PDIP
• Operating Temp Range: -40C to 85C
• Power Dissipation: 250mW
• Pin Count: 6
• Mounting: Through Hole
• Reverse Breakdown Voltage: 6V
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

©2005 Fairchild Semiconductor Corporation
H11L1M, H11L2M, H11L3M Rev. 1.0.3
Package Dimensions
Through Hole
5.08 (Max.)
6.10–6.60
0.38 (Min.)
1.02–1.78
(0.86)
3.28–3.53
Pin 1
6
1
8.13–8.89
0.41–0.51
0.25–0.36
0.76–1.14
4
3
2.54–3.81
2.54 (Bsc)
(Max.)
5.08
8.43–9.90
3.28–3.53
Note:
All dimensions in mm.
Surface Mount
0.38 (Min.)
6.10–6.60
1.02–1.78
(0.86)
Pin 1
15° (Typ.)
7.62 (Typ.)
6
1
8.13–8.89
0.41–0.51
0.25–0.36
0.76–1.14
4
3
2.54 (Bsc)
0.20–0.30
7
5.08 (Max.)
0.4" Lead Spacing
6.10–6.60
0.38 (Min.)
(10.54)
1.02–1.78
(0.86)
3.28–3.53
Pin 1
0.16–0.88
(7.49)
Rcommended Pad Layout
(8.13)
(1.78)
6
1
8.13–8.89
0.41–0.51
0.25–0.36
0.76–1.14
(2.54)
(0.76)
0.20–0.30
4
3
2.54–3.81
2.54 (Bsc)
(1.52)
10.16–10.80
www.fairchildsemi.com
0.20–0.30