08055E104MAT2A AVX Corporation, 08055E104MAT2A Datasheet

Capacitor, Ceramic; 0.1uF; Chip; Case 0805; +/-20%; 50WVDC; SMD; Z5U; 100000 Mohm; 0.05I

08055E104MAT2A

Manufacturer Part Number
08055E104MAT2A
Description
Capacitor, Ceramic; 0.1uF; Chip; Case 0805; +/-20%; 50WVDC; SMD; Z5U; 100000 Mohm; 0.05I
Manufacturer
AVX Corporation
Series
0805r
Datasheets

Specifications of 08055E104MAT2A

Tolerance (+ Or -)
20%
Voltage
50VDC
Temp Coeff (dielectric)
Z5U
Operating Temp Range
10C to 85C
Mounting Style
Surface Mount
Construction
SMT Chip
Case Style
Ceramic Chip
Failure Rate
Not Required
Wire Form
Not Required
Product Length (mm)
2.01mm
Product Depth (mm)
1.25mm
Product Height (mm)
1.3mm
Product Diameter (mm)
Not Requiredmm
Capacitance
.1uF
Package / Case
0805
Brand/series
AVX
Case Code
0805
Case Size
0805
Dielectric Strength
No breakdown or visual defects
Insulation Resistance
100000 Megohms
Length
0.079 in. ± 0.008 in.
Material, Element
Ceramic
Package Type
0805
Temperature, Operating, Maximum
125 °C
Temperature, Operating, Minimum
-55 °C
Termination
SMT
Tolerance
±20 %
Voltage, Rating
50 VDC
Width
0.049 in. ± 0.008 in.
Voltage Rating
50 Volts
Operating Temperature Range
+ 10 C to + 85 C
Temperature Coefficient / Code
Z5U
Product
General Type MLCCs
Dimensions
0.049 in W x 0.079 in L x 0.930 mm H
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Compliant
C0G (NP0) Dielectric
General Specifications
PART NUMBER (see page 2 for complete part number explanation)
4
(L" x W")
0805
Size
+0.5
-0.5
0
100,000
10,000
1,000
10.0
-55 -35 -15 +5 +25 +45 +65 +85 +105 +125
100
1.0
0.1
Variation of Impedance with Cap Value
1
Temperature Coefficient
100V = 1
200V = 2
500V = 7
Voltage
6.3V = 6
Typical Capacitance Change
10 pF vs. 100 pF vs. 1000 pF
10V = Z
16V = Y
25V = 3
50V = 5
Impedance vs. Frequency
Envelope: 0 ± 30 ppm/°C
5
0805 - C0G (NP0)
Temperature °C
10
Frequency, MHz
C0G (NP0) = A
Dielectric
100
A
1000 pF
100 pF
10 pF
1000
Capacitance
2 Sig. Digits +
Code (In pF)
Number of
101
Zeros
+2
+1
-1
-2
1KHz
0
1.0
0.1
10
Variation of Impedance with Chip Size
10
B = ±.10 pF (<10pF)
C = ±.25 pF (<10pF)
D = ±.50 pF (<10pF)
F = ±1% (≥ 10 pF)
G = ±2% (≥ 10 pF)
J = ±5%
K = ±10%
Impedance vs. Frequency
Capacitance vs. Frequency
10 KHz
1000 pF - C0G (NP0)
Capacitance
Tolerance
Frequency
Frequency, MHz
100 KHz
J
100
1206
0805
1812
1210
C0G (NP0) is the most popular formulation of the “tempera-
ture-compensating,” EIA Class I ceramic materials. Modern
C0G (NP0) formulations contain neodymium, samarium and
other rare earth oxides.
C0G (NP0) ceramics offer one of the most stable capacitor
dielectrics available. Capacitance change with temperature
is 0 ±30ppm/°C which is less than ±0.3% ∆ C from -55°C
to +125°C. Capacitance drift or hysteresis for C0G (NP0)
ceramics is negligible at less than ±0.05% versus up to
±2% for films. Typical capacitance change with life is less
than ±0.1% for C0G (NP0), one-fifth that shown by most
other dielectrics. C0G (NP0) formulations show no aging
characteristics.
The C0G (NP0) formulation usually has a “Q” in excess
of 1000 and shows little capacitance or “Q” changes with
frequency. Their dielectric absorption is typically less than
0.6% which is similar to mica and most films.
1 MHz
Applicable
A = Not
Failure
1000
Rate
10 MHz
A
1 = Pd/Ag Term
T = Plated Ni
7 = Gold Plated
Variation of Impedance with Ceramic Formulation
Terminations
10,000
Factory For
1,000
100
Contact
10.00
and Sn
1.00
0.10
0.01
0
0
Insulation Resistance vs Temperature
10
T
1000 pF - C0G (NP0) vs X7R
20
Impedance vs. Frequency
7 = Bulk Cass.
9 = Bulk
2 = 7" Reel
4 = 13" Reel
40
Frequency, MHz
Temperature °C
Packaging
Multiples
Contact
Factory
0805
For
100
2
60
80
X7R
NPO
Special
A = Std.
Product
Code
1000
A
100

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08055E104MAT2A Summary of contents

Page 1

... C from -55°C to +125°C. Capacitance drift or hysteresis for C0G (NP0) ceramics is negligible at less than ±0.05% versus up to ±2% for films. Typical capacitance change with life is less than ±0.1% for C0G (NP0), one-fifth that shown by most other dielectrics ...

Page 2

C0G (NP0) Dielectric Specifications and Test Methods Parameter/Test Operating Temperature Range Capacitance Q Insulation Resistance Dielectric Strength Appearance Capacitance Resistance to Variation Flexure Q Stresses Insulation Resistance ≥ 95% of each terminal should be covered Solderability Appearance No defects, <25% ...

Page 3

C0G (NP0) Dielectric Capacitance Range PREFERRED SIZES ARE SHADED SIZE 0201 0402 Soldering Reflow Only Reflow Only Packaging All Paper All Paper MM 0.60 ± 0.03 1.00 ± 0.10 (L) Length (in.) (0.024 ± 0.001) (0.040 ± 0.004) MM 0.30 ...

Page 4

C0G (NP0) Dielectric Capacitance Range PREFERRED SIZES ARE SHADED SIZE 1210 Soldering Reflow Only Packaging Paper/Embossed MM 3.20 ± 0.20 (L) Length (in.) (0.126 ± 0.008) MM 2.50 ± 0.20 (W) Width (in.) (0.098 ± 0.008) MM 0.50 ± 0.25 ...

Page 5

Packaging of Chip Components Automatic Insertion Packaging TAPE & REEL QUANTITIES All tape and reel specifications are in compliance with RS481. Paper or Embossed Carrier Embossed Only Paper Only Qty. per Reel/7" Reel 2,000, 3,000 or 4,000, 10,000, 15,000 Contact ...

Page 6

Embossed Carrier Configuration 8 & 12mm Tape Only DEFORMATION BETWEEN EMBOSSMENTS A 0 TOP COVER B TAPE CENTER LINES S 1 MAX. CAVITY OF CAVITY SIZE - SEE NOTE 1 ...

Page 7

Paper Carrier Configuration 8 & 12mm Tape Only T BOTTOM TOP COVER COVER TAPE TAPE & 12mm Paper Tape Metric Dimensions Will Govern CONSTANT DIMENSIONS Tape Size +0.10 8mm 1.50 1.75 ± ...

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