W3L16C474MAT1S AVX Corporation, W3L16C474MAT1S Datasheet - Page 2

• Manufacturer Part Number: W3L16C474MAT1S
• Manufacturer: AVX Corporation
• Type: IDC Low Inductancer

Specifications of W3L16C474MAT1S

• Capacitance: .47uF
• Tolerance (+ Or -): 20%
• Voltage: 6.3VDC
• Temp Coeff (dielectric): X7R
• Operating Temp Range: -55C to 125C
• Mounting Style: Surface Mount
• Package / Case: 1206
• Construction: SMT Chip
• Lead Spacing (nom): Not Requiredmm
• Product Diameter (mm): Not Requiredmm
• Product Height (mm): 0.55mm
• Product Depth (mm): 1.6mm
• Product Length (mm): 3.2mm
• Lead Free Status / RoHS Status: Compliant

Low Inductance Capacitors
Introduction
LAND GRID ARRAY (LGA) CAPACITORS
Land Grid Array (LGA) capacitors are based on the first Low
ESL MLCC technology created to specifically address the
design needs of current day Power Delivery Networks (PDNs).
This is the 3rd low inductance capacitor technology
developed by AVX. LGA technology provides engineers with
new options. The LGA internal structure and manufacturing
technology eliminates the historic need for a device to be
physically small to create small current loops to minimize
inductance.
The first family of LGA products are 2 terminal devices. A
2 terminal 0306 LGA delivers ESL performance that is equal
to or better than an 0306 8 terminal IDC. The 2 terminal 0805
LGA delivers ESL performance that approaches the 0508
8 terminal IDC. New designs that would have used 8 terminal
IDCs are moving to 2 terminal LGAs because the layout is
easier for a 2 terminal device and manufacturing yield is better
for a 2 terminal LGA versus an 8 terminal IDC.
LGA technology is also used in a 4 terminal family of products
that AVX is sampling and will formerly introduce in 2008.
Beyond 2008, there are new multi-terminal LGA product
families that will provide even more attractive options for PDN
designers.
60
0.001
0.01
0.1
1
1
Figure 2 MLCC, LICC, IDC, and LGA technologies deliver different levels of equivalent series inductance (ESL).
470 nF 0306 Impedance Comparison
10
Frequency (MHz)
LOW INDUCTANCE CHIP ARRAYS (LICA
The LICA
effort between AVX and IBM to develop a high performance
MLCC family of decoupling capacitors. LICA was introduced
in the 1980s and remains the leading choice of designers in
high performance semiconductor packages and high
reliability board level decoupling applications.
LICA
package applications on both ceramic and organic
substrates. The C4 solder ball termination option is the
perfect compliment to flip-chip packaging technology.
Mainframe class CPUs, ultimate performance multi-chip
modules, and communications systems that must have the
reliability of 5 9’s use LICA
LICA
used for decoupling in high reliability military and aerospace
applications. These LICA
large pin count FPGAs, ASICs, CPUs, and other high power
ICs with low operating voltages.
When high reliability decoupling applications require the very
lowest ESL capacitors, LICA
100
®
®
products are used in 99.999% uptime semiconductor
products with either Sn/Pb or Pb-free solder balls are
®
product family is the result of a joint development
®
®
devices are used for decoupling of
.
®
products are the best option.
1000
0603 MLCC
0306 2T-LGA
0306 LICC
0306 8T-IDC
®
)