SPT2AF-6PF20PPM Seiko Instruments, SPT2AF-6PF20PPM Datasheet - Page 10

CRYSTAL 32.768KHZ 6PF SMD

SPT2AF-6PF20PPM

Manufacturer Part Number
SPT2AF-6PF20PPM
Description
CRYSTAL 32.768KHZ 6PF SMD
Manufacturer
Seiko Instruments
Series
SP-T2A-Fr
Type
kHz Crystal (Tuning Fork)r

Specifications of SPT2AF-6PF20PPM

Frequency
32.768kHz
Frequency Tolerance
±20ppm
Load Capacitance
6pF
Operating Mode
Fundamental
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
4-SOJ, 5.50mm pitch
Size / Dimension
0.343" L x 0.146" W (8.70mm x 3.70mm)
Height
0.098" (2.50mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Frequency Stability
-
Other names
728-1004-2
MOUNTING PRECAUTIONS
10
Lead Type Crystal Units
• Structure
• Unbending the lead
• Bending the lead
• Soldering
Soldering directly to the case will reduce the degree of vacuum and may result in
deterioration of the characteristics and may break the crystal chip.
Tubular crystal units (VT, VTC) are hermetically sealed using glass (see Figures 1 and 2).
(1) DO NOT pull the lead excessively if unbending a lead or removing a crystal unit. The excessive force may
(2) Unbend the lead by pressing on the bent part from both the upper and lower sides with fixing the bottom of
(1) Bend the lead so that the lead will remain straight for more than 0.5mm from the case when soldering a
(2) Always leave a length greater than the case diameter when bending a lead after soldering (see Figure 7).
The soldering position has to be at the lead wire more than 1.0mm away from the glass seal.
A long period of time of heating at high temperature may result in deterioration of the characteristics and may
break the crystal unit.
If crystal unit is unavoidably heated, heat the lead part at 300
sure to keep the case below 150°C.
Quartz Crystal Unit Handling Precautions
Hermetic
crack the glass and reduce the degree of vacuum. This may eventually result in deterioration of the charac-
teristics and may also break the crystal chip(see Figure 3).
lead tightly. (see Figure ).
crystal unit after bending. If not, the glass may be cracked (see Figures 5 and ).
Glass
0.5mm
Figure 5
Figure 1
Figure 3
Solder
Lead
Breakage
Printed circuit
board
Case
°C
Figure 
or lower for 5 seconds or less and please make
Lead
0.5mm
Lead
Solder
Make the length from the case to the
printed circuit board (L) longer than the
case diameter (D) so that the lead wire
will not be pulled in case the crystal unit
falls over.
Figure 2
Figure 
Tweezers or
needle-nose pliers
Solder
Hermetic
Quartz Crystal 2011
Case
Glass
Case
Figure 7
D
L > D
L

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