PRF18AS471QS2RB Murata, PRF18AS471QS2RB Datasheet - Page 20

• Manufacturer Part Number: PRF18AS471QS2RB
• Manufacturer: Murata

Specifications of PRF18AS471QS2RB

• Lead Free Status / RoHS Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
The ceramic of this product is fragile, and care must
be taken to not load an excessive press-force, or to not
give a shock at handling.
Such forces may cause cracking or chipping.
4. Solder and Flux
5. Cleaning Conditions
6. Drying
7. Printing Conditions of Solder Paste
8. Adhesive Application and Curing
NCP15
NCP18
(1) Solder and Paste
For removing the flux after soldering, observe the
following points in order to avoid deterioration of the
characteristics or any change of the external electrodes'
quality.
After cleaning, promptly dry this product.
Notice (Handling)
The amount of solder is critical. Standard height of fillet is
shown in the table below.
Too much soldering may cause mechanical stress,
resulting in cracking, mechanical and/or electronic
damage.
Thin or insufficient adhesive may result in loose
component contact with land during flow soldering.
Low viscosity adhesive causes chips to slip after
mounting.
Continued from the preceding page.
(a) Reflow Soldering: NCP15/NCP18 Series
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Use RA/RMA type or equivalent type of solder paste.
For your reference, we are using the solder paste
below for any internal tests of this product.
•RMA9086 90-4-M20 (Sn:Pb=63wt%:37wt%)
(Manufactured by Alpha Metals Japan Ltd.)
•M705-221BM5-42-11
(Sn:Ag:Cu=96.5wt%:3.0wt%:0.5wt%)
(Manufactured by Senju Metal Industry Co., Ltd.)
Part Number
For NTC Thermistors Chip Type !Caution/Notice
The Solder Paste Thickness
100 m
150 m
Solvent
Dipping Cleaning
Ultrasonic Cleaning
Reference: Optimum Solder Amount
(2) Flux
(b) Flow Soldering: NCP18 Series
Use Rosin-based flux.
Do not use strong acidic flux (with halide content
exceeding 0.2wt%)
E
We are using the solder paste below for any internal
tests of this product.
•Sn:Pb=63wt%:37wt%
•Sn:Ag:Cu=96.5wt%:3.0wt%:0.5wt%
Isopropyl Alcohol
Less than 5 minutes at
room temp. or less than
2 minutes at 40 C max.
Less than 5 minutes
20W/r Frequency of 28
to 40kHz.
Electrode
Solder
NCP15
0.2mmVTVE
1/3EVTVE
T
Isopropyl Alcohol
Less than 5 minutes at
room temp. or less than
2 minutes at 40 C max.
Less than 1 minute
20W/r Frequency of
several 10 to 100kHz.
T
NCP18
Solder
R03E.pdf
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