NTCS0603E3223FMT Vishay, NTCS0603E3223FMT Datasheet - Page 6

THERMISTOR, NTC, 0603, 22K

NTCS0603E3223FMT

Manufacturer Part Number
NTCS0603E3223FMT
Description
THERMISTOR, NTC, 0603, 22K
Manufacturer
Vishay

Specifications of NTCS0603E3223FMT

Thermistor Type
NTC
Resistance
22kohm
Beta Value (k)
3730
Beta Value Lower Limit Temperature
25°C
External Depth
0.8mm
External Length / Height
0.8mm
External Width
1.6mm
Operating Temperature
RoHS Compliant
Lead Free Status / RoHS Status
Supplier Unconfirmed
Lead Free Status / RoHS Status
Supplier Unconfirmed

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTCS0603E3223FMT
Manufacturer:
VISHAY/威世
Quantity:
20 000
SOLDERING CONDITIONS
This SMD thermistor is only suitable for wave or reflow soldering, in accordance with JEDEC J-STD-020. The maximum
temperature of 260 °C during 40 s should not be exceeded.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
TESTS AND REQUIREMENTS
PACKAGING
TAPE SPECIFICATIONS
All tape specifications are in accordance with IEC 60286-3. Basic dimensions are given below. Carrier tape material is paper.
PAPER TAPE
Document Number: 29056
Revision: 10-Mar-11
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT
IEC 60068-2-58
300
250
200
150
100
50
0
6
D
0
0
≈ 245 °C
260 °C
215 °C
180 °C
130 °C
A
0
B
P
50
0
1
P
Reflow Soldering
2
TEST METHOD
2 K/s
P
0
100
T
C
Time (s)
150
For technical questions, contact:
10 s
10 s
E
F
JWB288
This datasheet is subject to change without notice.
40 s
1.0
Resistance to soldering heat
1
SMD 0603, Glass Protected
W
200
Solderability
NTC Thermistors
0.8
Dimensions of the solder lands
TEST
T
T
250
1
2.4
Notes
• Measured 0.3 mm above base pocket
• P
DIMENSIONS OF PAPER TAPE in millimeters
PARAMETER
A
B
W
E
F
D
P
P
P
T tape thickness
T
1
0
0
1
0
1
2
0
0
cover tape
nlr@vishay.com
(1)
(1)
(2)
pitch cumulative error over any 10 pitches ± 0.2 mm
300
250
200
150
100
50
0
0
PROCEDURE
10 s at 260 °C
Lead (Pb)-free Reflow Soldering Profile
2 s at 235 °C
≈ 245 °C
≈ 170 °C
235 °C
260 °C
50
100
2 K/s
max.
Vishay BCcomponents
≈ 120 °C
DIMENSION
NTCS0603E3.....T
150
Time (s)
< 0.1
1.15
1.75
1.55
Min. 95 % of surface wetted
1.9
8.0
3.5
4.0
4.0
2.0
1.1
200
www.vishay.com/doc?91000
REQUIREMENTS
R/R < 5 %
250
20 s min.
40 s max.
≈ 60 s
TOLERANCE
www.vishay.com
6 K/s
max.
limit
normal
300
± 0.05
± 0.05
± 0.05
± 0.1
± 0.1
± 0.2
± 0.1
± 0.1
± 0.1
Max.
-
350
15

Related parts for NTCS0603E3223FMT