EB52F3C50N-10.240M Ecliptek, EB52F3C50N-10.240M Datasheet - Page 4

• Manufacturer Part Number: EB52F3C50N-10.240M
• Manufacturer: Ecliptek

Specifications of EB52F3C50N-10.240M

• Output Level: LVCMOS
• Symmetry Max: 60%
• Operating Supply Voltage (typ): 3.3
• Mounting Style: Through Hole
• Screening Level: Commercial
• Rad Hardened: No
• Lead Free Status / RoHS Status: Not Compliant

Recommended Solder Reflow Methods
Low Temperature Solder Bath (Wave Solder)
T
Preheat
- Temperature Minimum (T
- Temperature Typical (T
- Temperature Maximum (T
- Time (t
Ramp-up Rate (T
Time Maintained Above:
- Temperature (T
- Time (t
Peak Temperature (T
Target Peak Temperature (T
Time within 5°C of actual peak (t
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
Low Temperature Solder Bath (Wave Solder) Note 1
Device is non-hermetic; Post reflow aqueous wash is not recommended
Low Temperature Solder Bath (Wave Solder) Note 2
Temperatures shown are applied to back of PCB board and device leads only.
S
EB52F3C50N-10.240M
MAX to T
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/10/2011 | Page 4 of 4
S
L
)
MIN)
L
(Ramp-up Rate)
L
L
)
T Max
to T
T Min
S
S
P
)
P
)
T
T
P
L
S
TYP)
S
S
MIN)
P
MAX)
Target)
p
)
t Preheat
S
5°C/second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 1 Time / 235°C Maximum 2 Times
5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times
5°C/second Maximum
N/A
Level 1
t 25°C to Peak
Ramp-up
Time (t)
t
P
t
L
Critical Zone
T to T
L
Ramp-down
P