EH2645TS12.000M Ecliptek, EH2645TS12.000M Datasheet
EH2645TS12.000M
Specifications of EH2645TS12.000M
Related parts for EH2645TS12.000M
EH2645TS12.000M Summary of contents
Page 1
... Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 2/27/2011 | Page RoHS EH26 45 TS -12.000M Nominal Frequency 12.000MHz Pin 1 Connection Tri-State (High Impedance) Duty Cycle 50 ± ...
Page 2
... ORIENTATION ±0.15 1.60 ±0.20 Suggested Solder Pad Layout All Dimensions in Millimeters 2.0 (X4) 2.2 (X4) Solder Land 2.88 (X4) 1.81 All Tolerances are ±0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 2/27/2011 | Page 5.08 ±0. 1.4 ±0.1 3.68 ±0.15 PIN CONNECTION 1 Tri-State (High ...
Page 3
... V Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value C includes sum of all probe and fixture capacitance. L www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 2/27/2011 | Page Rise T W Time T ...
Page 4
... Target Peak Temperature (T Target) P Time within 5°C of actual peak (t p Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 2/27/2011 | Page Ramp-up t Preheat S t 25°C to Peak Time (t) 3°C/second Maximum 150°C 175°C 200° ...
Page 5
... Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) High Temperature Manual Soldering 260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 2/27/2011 | Page Ramp-up t Preheat S t 25° ...