EMIF02MIC02F1 STMicroelectronics, EMIF02MIC02F1 Datasheet - Page 6

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EMIF02MIC02F1

Manufacturer Part Number
EMIF02MIC02F1
Description
Manufacturer
STMicroelectronics
Datasheet

Specifications of EMIF02MIC02F1

Mounting Style
Surface Mount
Termination
Flat Style
Operating Temp Range
-40C to 85C
Product Height (mm)
0.65mm
Product Depth (mm)
0.92mm
Product Length (mm)
1.42mm
Lead Free Status / RoHS Status
Not Compliant
Ordering information
5
Note:
6/8
Figure 15. Flip Chip tape and reel specification
Ordering information
Table 3.
More information is available in the application notes:
AN1235:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
Figure 13. Footprint
EMIF02-MIC02F2
340 µm min for 300 µm copper pad diameter
Order code
Solder mask opening recommendation:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Copper pad Diameter:
Ordering information
All dimensions in mm
Marking
0.73 ± 0.05
FJ
Dot identifying Pin A1 location
Package
Flip Chip
User direction of unreeling
Figure 14. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
4 ± 0.1
1.02
Weight
2.3 mg
(y = year
ww = week)
4 ± 0.1
Ø 1.5 ± 0.1
Base qty
5000
EMIF02-MIC02F2
x
y
Tape and reel 7”
Delivery mode
w
x
w
E
z

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