EMIF02-MIC04F2 STMicroelectronics, EMIF02-MIC04F2 Datasheet - Page 5

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EMIF02-MIC04F2

Manufacturer Part Number
EMIF02-MIC04F2
Description
Manufacturer
STMicroelectronics
Datasheet

Specifications of EMIF02-MIC04F2

Mounting Style
Surface Mount
Termination
Flat Style
Operating Temp Range
-40C to 85C
Product Height (mm)
0.65mm
Product Depth (mm)
1.27mm
Lead Free Status / RoHS Status
Compliant
Figure 10: Order code
Figure 11: FLIP-CHIP Package Mechanical Data
Figure 12: Foot print recommendations
340µm min for 315µm copper pad diameter
Solder mask opening recommendation :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Copper pad Diameter :
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 1: 500µm, Bump = 315µm
= 2: Leadfree Pitch = 500µm, Bump = 315µm
500µm ± 10
250µm ± 10
1.07mm ± 50µm
315µm ± 50
EMIF
Figure 13: Marking
Dot, ST logo
xx = marking
z = packaging
location
yww = datecode
All dimensions in µm
(y = year
yy
ww = week)
-
xxx zz
650µm ± 50
365
Fx
EMIF02-SPK01F1
x
y
240
w
x
w
z
5/7

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