ST-4ETA504 Vishay, ST-4ETA504 Datasheet - Page 5

• Manufacturer Part Number: ST-4ETA504
• Manufacturer: Vishay
• Type: Trimmerr

Specifications of ST-4ETA504

• Resistance: 500kohm
• Power Rating: 1/4W
• Tolerance (+ Or -): 20%
• Number Of Turns: 1Turn
• Technology: Cermet
• Mounting Style: Surface Mount
• Termination Style: J-Hook
• Operating Temp Range: -55C to 125C
• Failure Rate: Not Required
• Shaft Diameter (mm): 2.3mm
• Product Diameter (mm): Not Requiredmm
• Product Length (mm): 5mm
• Product Height (mm): 2.3mm
• Product Depth (mm): 5.2mm
• Temperature Coefficient: ±100
• Lead Free Status / RoHS Status: Compliant

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5
ST-4
Vishay
Reflow profile for soldering heat evolution
MECHANICAL SPECIFICATIONS
Mechanical angle
Operating torque
Stop strength
Rotational life
Thrust to rotor
Solderability
Shear (Adhesion)
Substrate bending
Pull-off strength
ELECTRICAL SPECIFICATIONS
Nominal resistance
range
Resistance tolerance
Power ratings
Resistance law
Maximum input
voltage
Maximum wiper
current
Effective electrical turn
End resistance
C.R.V.
Operating temp. range
Temp. coefficient
Insulation resistance
Dielectric strength
Net weight
250
200
150
100
(°C)
50
180°C
150°C
Pre Heating Zone
Peak : 250
Reflow : two times maximum
Heating time
100 Ω ∼ 2MΩ: ± 100 10
240° (1 turn)
10 mN m {102 gf cm} maximum
30 mN m {306 gf cm} minimum
100 cycles [ΔR/R ≤ ± (2 Ω + 3 %]
5 N {0.51 kgf} minimum
Sn-Pb: 235 °C, 2 s
Sn-Cu (Lead (Pb)-free): 245 ± 3 °C, 2 ∼
3 s
5 N {0.51 kgf} 10 s
Width 90 mm, bend 3 mm, 5 s, 1 time
5 N {0.51 kgf} 10 s
DC200 V or power rating, whichever is
10 Ω ∼ 50 Ω: ± 250 10
Approx. 0.12 g (ST-4A, B, C, D, F, EA,
Over 230 °C
100 mA or power rating, whichever is
Approx. 0.22 g (ST-4G, H, EG, EH)
90 ± 30 s
1 % or 2 Ω, whichever is greater
1 % or 3 Ω, whichever is greater
1000 MΩ minimum (DC500 V)
0.25 W (70 °C) 0 W (125 °C)
30 ± 10 s
Surface Mount Cermet Trimmers (single turn)
+5
0
°C
EB, EC, ED, EF)
AC500 V, 60 s
Linear law (B)
10 Ω ∼ 2 MΩ
- 55 ∼ 125 °C
210° (1 turn)
Soldering Zone
For technical questions contact: [e-mail]
smaller
smaller
± 20 %
-6
-6
/°C maximum
/°C maximum
ENVIRONMENTAL SPECIFICATIONS
Test item
Thermal shock
Humidity
Shock
Vibration
Load Life
Low
temperature
operation
High
temperature
exposure
Immersion seal
Soldering heat
board, 5 ∼ 6 s, two times
the temperature in a pot
immersion from head of
260 °C, 10 s or 215 °C,
6 directions for 3 times
Flow: 260 °C ± 3 °C as
terminal to backside of
Acceleration 196 m/s
Amplitude 1.52 mm or
70 °C, 0.25 W, 1000 h
- 10 ∼ 65 °C (Relative
- 65 ∼ 125 °C (0.5 h),
humidity 80 ∼ 98 %),
temperature 255 °C
350 ± 10 °C, 3 ∼ 4 s
directions, 12 times
(Please refer to the
Manual soldering:
Test conditions
of molten solder,
10 cycles, 240 h
10 ∼ 2000 Hz, 3
981 m/s
profile below.)
125 °C, 250 h
Reflow: Peak
- 55 °C, 2 h
85 °C, 60 s
maximum
5 cycles
Sn-Pb
Sn-Cu
each
each
35 s
2
, 6 ms
Document Number: 58010
2,
continuous bubbles)
Revision: 06-Mar-06
Specifications
No leaks (No
[ΔR/R ≤ 2 %]
[ΔR/R ≤ 2 %]
[ΔR/R ≤ 3 %]
[ΔR/R ≤ 2 %]
[ΔR/R ≤ 3 %]
[ΔR/R ≤ 1 %]
[ΔR/R ≤ 1%]
[S.S. ≤ 1 %]
[S.S. ≤ 1 %]
[S.S. ≤ 1 %]
[S.S. ≤ 2 %]
[S.S. ≤ 2 %]