1981584-1 TE Connectivity, 1981584-1 Datasheet - Page 65

• Manufacturer Part Number: 1981584-1
• Description: RECEPTACLE, MICRO USB, TYPE AB
• Manufacturer: TE Connectivity
• Series: ABr

Specifications of 1981584-1

• Gender: RCP
• Number Of Ports: 1Port
• Body Orientation: Right Angle
• Number Of Terminals: 5
• Contact Material: Copper Alloy
• Number Of Contacts: 5POS
• Mounting Style: Surface Mount
• Termination Method: Solder
• Housing Material: Thermoplastic
• Contact Plating: Gold Over Nickel
• Pitch (mm): 0.65mm
• Connector Type: Series
• No. Of Contacts: 5
• Contact Termination: Surface Mount Horizontal
• Connector Mounting: PCB
• Rohs Compliant: Yes
• Product: Micro USB Type AB Connectors
• Standard: USB
• Termination Style: SMD/SMT
• Number Of Positions / Contacts: 5
• Size: Micro
• Orientation: Right Angle
• Mount Location: Top
• Locking Feature: Without
• Led: Without
• Panel Ground: Without
• Pcb Mount Retention Type: SMT Hold Down
• Shell Plating: Reflowed Tin over Nickel
• Assembly Process Feature: Without Pick and Place Cover
• Locating Post(s): Without
• Number Of Positions: 5
• Contact Termination Type: Surface Mount
• Contact Plating, Mating Area, Material: Gold
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.762 [30]
• Housing Color: Gray
• Industry Standard: USB 2.0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Usb-if Test Id Number (tid): 60001338
• Applies To: Printed Circuit Board
• Pcb Thickness, Recommended (mm [in]): 1.00 [0.039]
• Packaging Method: Tape & Reel
• Lead Free Status / RoHS Status: Compliant

MID Technology
at Tyco Electronics
Tyco Electronics prides itself
in being the global leader in
providing Molded Interconnect
Technology (MID). In it’s most
basic form, MID technology
can be defined as any product
that results in selectively plated
plastic parts. This technology
can be used in three basic
ways, to solve 3-dimensional
electro-mechanical problems,
for shielding purposes, or to
develop antennas.
MID Technologies
Tyco Electronics can manu-
facture MID parts using three
manufacturing technologies,
Two Shot, Laser Imaging, and
Laser Direct Structuring.
Products for Mobile Equipment
MID Technology
MID
Two Shot MID Technology
Two Shot
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Laser Imaging MID Technology
Laser Imaging today is typically only used for rapid prototyping
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All specifications subject to change. Consult Tyco Electronics for latest specifications.
Sequential injection molded substrate
A plateable resin and a non-plateable resin
Imaging in the molding process
All electroless plating of catalyzed surfaces
Manufacturing using a circuit board production type process
Machine or single shot mold in 3–10 days
Laser image circuitry in 3–5 days
Circuitry and plating are accurate to production processes
Catalog 1654270-2
Revised 8-2007
63