145113-1 TE Connectivity, 145113-1 Datasheet - Page 11
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145113-1
Manufacturer Part Number
145113-1
Description
Manufacturer
TE Connectivity
Type
Card Edger
Datasheet
1.145113-1.pdf
(96 pages)
Specifications of 145113-1
Number Of Contacts
184POS
Number Of Contact Rows
2
Body Orientation
Straight
Contact Plating
Gold Over Nickel
Contact Material
Phosphor Bronze
Termination Method
Solder
Mounting Style
Surface Mount
Product Height (mm)
15.49mm
Operating Temp Range
-55C to 85C
Pitch (mm)
1.27mm
Housing Material
Thermoplastic
Housing Color
Natural
Current Rating (max)
1/ContactA
Voltage Rating Max
203VAC
Contact Resistance Max
30
Pcb Mounting Orientation
Vertical
Number Of Dual Positions
92
Pcb Mount Style
Surface Mount
Holddown Material
Brass
Holddown Plating
Tin-Lead over Nickel
Voltage (vac)
5
Solder Tail Contact Plating
Tin-Lead over Nickel
Number Of Positions
184
Centerline (mm [in])
1.27 [0.050]
Bus Width
64 Bit
Pcb Mount Retention Type
Hold Down Post(s)
Ejector
Without
Number Of Holddowns
2
Family Name
PCI
Contact Plating, Mating Area, Material
Gold (30)
Contact Base Material
Phosphor Bronze
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Reflow solder capable to 245°C
Lead Free Status / RoHS Status
Not Compliant
Product Facts
Performance Specifications:
Contact Current Rating* —1 ampere
Termination Resistance —
20 milliohms max. (initial)
30 milliohms max. (final)
Dielectric Withstanding Voltage —
500 VAC min.
Insulation Resistance — 1000
megohms min.
Mating Force — .5 oz. [0.14 N] per
contact pair
Unmating Force — 1 oz. [0.3 N] per
contact pair
Durability (Tested to) — 100 mating
cycles
Application Temperature —
+215°C for 120 seconds max.
Temperature Range —
–55°C to +85°C
*Consult Tyco Electronicsengi-
Catalog 1654080
Issued 7-03
www.tycoelectronics.com
neering when paralleling con-
tacts for power applications.
High density .050 [1.27]
centerline spacing of
contacts
Easy mating of high-circuit
count daughter boards
Compatible with infrared
reflow (IR) soldering
techniques
Polarizing web for positive
board-to-connector
registration
Choice of plastic pylons or
metal holddowns
Recognized under the
Component Program of
Underwriter
Laboratories Inc.
File No. E28476
Certified by Canadian
Standards
Association,
File No. LR 7189
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
®
Card Edge Connectors
(Solder Type Board-to-Board)
Standard Edge .050 Series Connectors
The need to conserve
space and pack more func-
tion into a given area has
demanded that .050 [1.27]
centerline spacing become
a reality. AMP Standard
Edge .050 Series connec-
tors are the ideal vehicle for
mother/daughter board
applications requiring this
real estate.
These rugged connectors
have two rows of contacts
on .050 [1.27] centerlines.
Polarizing webs provide
positive board-to-connector
registration, while insertion
force allows even high
circuit-count daughter
boards to mate easily. The
connectors accept .054 to
.070 [1.37 to 1.78] thick
daughter boards and fea-
ture an overstress protected
contact design.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
AMP Standard Edge .050
Series connectors are ideal
for fast automated robotic
assembly with registration
features and dimensional
tolerancing for more accurate
pickup and placement, and
are packaged in robotics-
compatible trays.
Plastic guide posts or metal
holddowns align the con-
nector with the mother board
and retain it for soldering.
To make circuit routing easy,
connector solder posts are
arranged in a four-row .100
[2.54] staggered grid. High-
temperature tolerant mate-
rials promote that these
connectors withstand
infrared reflow (IR) solder-
ing, while standoffs ease
flux cleaning.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
High Density for DataBus
Applications
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