7-119254-9 TE Connectivity, 7-119254-9 Datasheet - Page 116
7-119254-9
Manufacturer Part Number
7-119254-9
Description
AMP PACE CONN 43POS 156X200C/L
Manufacturer
TE Connectivity
Type
Card Edger
Datasheet
1.7-119254-9.pdf
(204 pages)
Specifications of 7-119254-9
Number Of Contacts
43POS
Body Orientation
Straight
Contact Plating
Gold Over Nickel
Contact Material
Phosphor Bronze
Termination Method
Solder
Mounting Style
Through Hole
Pitch (mm)
3.96mm
Housing Material
Polyester
Housing Color
Blue
Product Line
AMP PACE
Product Type
Connector
Connector Type
Connector Assembly
Number Of Dual Positions
43
Housing Style
Closed End/Closed End - Standard
Post Alignment
Clear Polyester Contact Tip Strip
Proprietary Name
AMP PACE
Termination Post Length (mm [in])
12.07 [0.475]
Centerline (mm [in])
3.96 [0.156]
Row Spacing (mm [in])
5.08 [0.200]
Pre-assembled
Yes
Post Plating
Matte Tin
Pcb Mount Retention Type
Compliant Posts
Contact Plating, Mating Area, Material
Gold (30)
Contact Base Material
Phosphor Bronze
Underplate Material
Nickel
Connector Style
Card Edge
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Not relevant for lead free process
Rohs/elv Compliance History
Always was RoHS compliant
Lead Free Status / RoHS Status
Compliant
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Product Facts
Performance Specifications
Current Rating*:
3 amperes max.
Mating Force (Contact Pair):
1 lb. [4.4 N] max.
Durability (Mating Cycles):
100 min.
Termination Resistance:
12 milliohms max.
Dielectric Rating:
1200 VAC (rms)
Insulation Resistance:
5000 megohms max.
Operating Temperature:
–55°C to +85°C
*Consult Tyco Electronics
Catalog 1654080
Issued 7-03
www.tycoelectronics.com
when paralleling contacts
for power applications.
High density - .0625 [1.586]
contact centerlines
Compliant ACTION PIN
contacts press-fit into
plated-through holes for
solderless application
Individually replaceable
contacts
Accommodates up to three
levels of daughter card pads
for sequencing
.125 [3.18] square grid post
arrangement
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
The high performance AMP
TELEDENSITY connector is
a high density, card edge,
telecommunications con-
nector. It features compliant
ACTION PIN contacts for
solderless application to
multi-layer printed circuit
boards with plated-through
or bare copper holes.
These connectors accept
.054 to .072 [1.37 to 1.83]
thick daughter cards. To
satisfy the broadest range
of application needs, the
Card Edge Connectors
(Press-Fit Board-To-Board)
TELEDENSITY Connectors
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
contacts are plated with 30
microinches of gold in the
mating area and tin-lead on
the posts. A plastic locating
strip keeps posts positioned
correctly for board insertion.
For high-density needs,
TELEDENSITY connectors
offer a .0625 [1.586] daugh-
ter card contact centerline
spacing in 39-, 71-, or 99-
dual positions. The connec-
tor’s .330 [8.38] slot depth
accommodates up to three
levels of daughter card
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
pads for sequencing, while
a biasing wedge maintains
proper pad alignment dur-
ing card extraction. Posts
are arranged in a .125
[3.18] square grid to ease
circuit routing.
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
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