1-487547-1 TE Connectivity, 1-487547-1 Datasheet - Page 2

• Manufacturer Part Number: 1-487547-1
• Description: CONTACT, SOCKET, IDC / IDT
• Manufacturer: TE Connectivity
• Type: Contactr
• Series: -r

Specifications of 1-487547-1

• Contact Gender: RCP
• Mounting Style: Cable
• Number Of Contact Rows: Not Required
• Number Of Contacts: 1POS
• Pitch (mm): Not Requiredmm
• Body Orientation: Straight
• Voltage Rating Max: 100VAC
• Operating Temp Range: -55C to 105C
• Housing Material: Not Required
• Housing Color: Not Required
• Contact Material: Phosphor Bronze
• Contact Plating: Gold Over Nickel
• Termination Method: Crimp
• Connector Type: FFC / FPC Contact
• Contact Termination: Crimp
• Peak Reflow Compatible (260 C): Yes
• Outer Diameter: 1.27mm
• Rohs Compliant: Yes
• Pin Or Socket: Socket
• Wire Gauge: -
• Contact Finish: Gold
• Contact Finish Thickness: Flash
• Product Type: Contact
• Termination Method To Wire/cable: IDC
• Wire/cable Type: FFC
• Solder Tail Contact Plating: Gold Flash
• Centerline (mm [in]): 1.27 [0.050]
• Contact Type: Socket
• Contact Plating, Mating Area, Material: Gold Flash over Palladium Nickel or Gold (30) over Nickel
• Underplate Material: Nickel
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Packaging Method: Strip
• Lead Free Status / RoHS Status: Compliant
• For Use With: AMPMODU MTE Connectors
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

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Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Product Facts
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High density; contacts
spaced on .050 x .100
[1.27 x 2.54] centers
Single row; select sizes 4
thru 50 positions
Double row; select sizes 10
thru 100 positions
Stand-offs for ease of
cleaning
High temperature tolerant
thermoplastic housings
Shrouded and unshrouded
headers available in single
and double row, vertical
and right-angle
configurations
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
Thru-Hole Headers––Shrouded, .050 x .100 [1.27 x 2.54] Centerline,
Board-to-Board
The AMPMODU System 50
interconnection system is
designed to better meet
industry’s need for a high
density interconnect
system. The Board
Mounted Thru-Hole
Headers are available in
shrouded and unshrouded
versions. They are
composed of single and
double row post headers
with .050 x .100
[1.27 x 2.54] spacing
between contacts for
extreme density and
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
efficient use of printed
circuit board area. The
headers are available in
4 through 50 positions, in
a single row configuration,
and 10 through 100
positions, in a double row
design.
Board mounted post
headers are available in
right-angle and vertical
configurations. Shrouded
post headers provide
polarization and alignment
features for mating printed
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
circuit boards and cable
connectors, while
unshrouded headers allow
close stacking of daughter
cards. Housings for the
headers are made of black
thermoplastic material with
a 94V-0 rating. The
housings have stand-offs
for free drainage of flux
cleaning solutions.
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208