9-103765-0 TE Connectivity, 9-103765-0 Datasheet - Page 78

• Manufacturer Part Number: 9-103765-0
• Description: BOARD-BOARD CONN, HEADER, 40WAY, 1ROW
• Manufacturer: TE Connectivity
• Type: Unshrouded Headerr
• Series: AMPMODU Mod IIr

Specifications of 9-103765-0

• Pitch (mm): 2.54mm
• Gender: HDR
• Number Of Contacts: 40POS
• Number Of Contact Rows: 1
• Mounting Style: Through Hole
• Body Orientation: Right Angle
• Contact Plating: Gold Over Nickel
• Operating Temp Range: -65C to 105C
• Termination Method: Solder
• Current Rating (max): 3/ContactA
• Contact Material: Phosphor Bronze
• Housing Material: Thermoplastic
• Housing Color: Black
• Product Height (mm): 3.51mm
• Product Length (mm): 101.19mm
• Product Depth (mm): 9.4mm
• Pitch Spacing: 2.54mm
• No. Of Rows: 1
• No. Of Contacts: 40
• Contact Termination: Right Angle Through Hole
• Rohs Compliant: Yes
• Product Type: Connector
• Mount Angle: Right Angle
• Pcb Mount Retention: Without
• Surface Mount Compatible: No
• Board Standoff: Without
• Mounting Ears: Without
• Mating Connector Lock: Without
• Post Size (mm [in]): 0.64 [.025]
• Mating Post Length (mm [in]): 5.84 [0.230]
• Panel Mount Retention: Without
• Termination Post Length (mm [in]): 2.29 [0.090]
• Solder Tail Contact Plating: Tin over Nickel
• Header Type: Breakaway
• Number Of Positions: 40
• Centerline (mm [in]): 2.54 [0.100]
• Row-to-row Spacing (mm [in]): 2.54 [0.100]
• Number Of Rows: 1
• Selectively Loaded: No
• Mount Type: Printed Circuit Board
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Shape: Square
• Contact Base Material: Phosphor Bronze
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Rohs/elv Compliance History: Always was RoHS compliant
• High Temperature Housing: No
• High Speed Serial Data Connector: No
• Lead Free Status / RoHS Status: Compliant

.025 x .025 [0.64 x 0.64]
Straight Post (with
Pin Protection)
Material and Finish:
Housing—Brown glass-filled
thermoplastic, flame retardant
P o s t s—Phosphor bronze, duplex plated
.000015 [0.00038] gold on mating area,
.000100-.000200 [0.00254-0.00508]
tin-lead on solder area, with entire post
underplated .000050 [0.00127] nickel
Catalog 1307819
Revised 6-04
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
(at Surface)
AMPMODU Interconnection System
Note: This header mates with receptacle assembly having the same number of active positions. See page 159.
Headers, Double-Row, 1.200 [30.48] Height
[1.96]
(at .340 [8.64]
[8.64]
.077
.340
[1.85]
.073
No. of
Pos.
Depth)
52
[6.35]
Dia.
.250
Dia.
[6.73]
.265
[8.13]
.320
[2.54]
.100*
[3.81±0.08]
.250±.003
[1.27±0.08]
.050±.003
3.320 [84.33]
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
A
[2.29]
.090
accumulate within one connector pattern.
Recommended PC Board Hole Layout
[2.54]
.100
*±.003 [±0.08] tolerances not to
Typ.
A
B
C
D
3.000 [76.2]
B
[2.54]
.100*
[6.35]
Typ.
.250
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
Dimensions
B
C
[1.09±0.13]
.043±.005
2.500 [63.5]
C
[1.02]
.040
[2.54]
.100
[8.89]
.350
Min.
[3.15]
.124
3.030 [76.96]
[3.18]
.125
Dia.
[30.48]
1.200
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
[8.84]
[2.49]
.348
.098
D
[1.52]
[2.13]
.060
.084
[6.81]
.268
Sq. Posts
102826-1
Part No.
[0.64]
Header
.025
Sq. Posts
[0.64]
.025
[21.97]
[6.99]
.865
.275
161
5