5146896-1 TE Connectivity, 5146896-1 Datasheet - Page 2

• Manufacturer Part Number: 5146896-1
• Description: 1FHR,64,30A/S,S,C,S14,15
• Manufacturer: TE Connectivity
• Type: IEEE 1386r

Specifications of 5146896-1

• Gender: RCP
• Number Of Contacts: 64POS
• Contact Material: Phosphor Bronze
• Contact Plating: Gold Over Nickel
• Number Of Ports: 1Port
• Body Orientation: Straight
• Pitch (mm): 1mm
• Number Of Terminals: 64
• Housing Material: Thermoplastic
• Operating Temp Range: -40C to 85C
• Mounting Style: Surface Mount
• Termination Method: Solder
• Current Rating (max): 1/ContactA
• Voltage Rating Max: 100VAC
• Product Length (mm): 35.9mm
• Pcb Mount Retention: With
• Pcb Mount Alignment: With
• Product Type: Connector
• Connector Type: Connector Assembly
• Product Line: 1mm FH
• Ul File Number: E28476
• Csa File Number: LR7189
• Termination Method To Pc Board: Surface Mount
• Pcb Mounting Orientation: Vertical
• Pcb Mount Alignment Type: Locating Posts
• Contact - Rated Current (a): 0.8
• Operating Voltage Reference: AC/DC
• Operating Voltage (vac): 250
• Operating Voltage (vdc): 250
• Tail Length (mm [in]): 2.05 [0.081]
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 10.37 [0.408]
• Number Of Positions: 64
• Number Of Columns: 32
• Centerline (mm [in]): 1.00 [0.039]
• Underplate Material Thickness (µm [?in]): 1.27 [50.000]
• Length (x-axis) (mm [in]): 34.22 [1.347]
• Width (z-axis) (mm [in]): 6.04 [0.238]
• Number Of Rows: 2
• Pcb Mount Retention Type: Locating Posts
• Mating Retention: Without
• Contact Base Material: Phosphor Bronze
• Contact Plating, Mating Area, Material: Gold
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.762 [30]
• Tail Plating Material: Matte Tin
• Tail Plating, Thickness (µm [?in]): 3.81 [150]
• Underplate Material: Nickel
• Contact Design: Single Beam
• Pitch (mm [in]): 16.00 [0.630]
• Connector Style: Receptacle
• Ul Flammability Rating: UL 94V-0
• Housing Color: Black
• Mating Alignment: Without
• Stack Height (mm [in]): 14.00 [0.551], 15.00 [0.591]
• Differential Signaling: With
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Industry Standard: IEEE 1386 Mezzanine Connector
• Agency/standard: UL, CSA
• Ul Rating: Listed
• Csa Certified: Yes
• Operating Temperature (°c [°f]): -55 – +110 [-67 – +230]
• Applies To: Printed Circuit Board
• Board-to-board Configuration: Mezzanine
• Pick And Place Cover: With
• Application Use: Board-to-Board
• Contact Transmits (typical Application): Signal (Data)
• Packaging Method: Tape & Reel
• Lead Free Status / RoHS Status: Compliant

Product Facts
Technical Documents
Product Specification
108-2246
Catalog 889092
Revised 9-06
www.tycoelectronics.com
For board stacking
applications
High density packaging on
1.0 [.039] centerline spacing
Available in standard
64-position and optional
84-position sizes
“Tape-and-reel” packaged
per EIA standards
Board stacking heights
available from 8 [.315] to
15 [.591] (see page 84)
Increased plastic clearance
eliminates stress to solder
joints during mating (see
page 84)
Improved locating posts
ensure accurate hand or
robotic placement (see
page 84)
Meets EIA-700 AAAB
specifications for IEEE 1386
applications
All 1.0mm Free Height
products within this section
are RoHS Compliant
(page 113)
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Fine Pitch SMT Stacking Connectors
(Parallel Board-to-Board)
1.0mm Free Height (FH) (IEEE 1386) Connectors
As a standard for adding
local PCI or Sbus perform-
ance to Futurebus+ and
VMEbus applications,
IEEE 1386 offers new levels
of performance and pack-
aging convenience through
the mezzanine architecture.
Tyco Electronics makes it
easier and more productive
to add an IEEE 1386 mez-
zanine connector to your
system. The surface-mount
parallel stacking connector
features contacts on a 1.0
[.039] pitch and is available
in eight stacking heights
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
from 8 [.315] to 15 [.591].
Sizes include the IEEE 1386
standard 64-position
version and an optional
84-position version.
Not only is the connector
compatible with EIA-700
AAAB — the connector
standard for IEEE 1386
mezzanine connectors —
it offers several enhance-
ments that make it easier to
use and more reliable.
Increased plastic clearance
between mating connectors
makes it easier to align mul-
tiple connectors for mating,
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
thus eliminating stress to
the solder joints during
engagement. Improved
locating posts allow fast,
highly accurate hand place-
ment of connectors. The
connectors are available
with vacuum covers for
automated placement.
Performance Characteristics
Current Rating —
1.0 ampere per contact
Contact Resistance —
30 milliohms max. (initial)
Durability — tested to 100 mating
cycles min.
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
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