R75PI3150DQ3-J Kemet, R75PI3150DQ3-J Datasheet - Page 9

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R75PI3150DQ3-J

Manufacturer Part Number
R75PI3150DQ3-J
Description
Manufacturer
Kemet
Datasheet

Specifications of R75PI3150DQ3-J

Tolerance (+ Or -)
5%
Voltage
630VDC/250VAC
Mounting Style
Through Hole
Construction
Radial
Failure Rate
Not Required
Seated Plane Height
14.5mm
Product Diameter (mm)
Not Requiredmm
Product Height (mm)
14.5mm
Product Depth (mm)
8.5mm
Product Length (mm)
18mm
Lead Spacing (nom)
15mm
Lead Diameter (nom)
0.8mm
Operating Temp Range
-55C to 105C
Capacitance
.15uF
Package / Case
Not Required
Lead Free Status / RoHS Status
Supplier Unconfirmed
ElECtRICAl CHARACtERIStICS
Rated voltage (V
Rated temperature (t
temperature derated voltage:
The following decreasing factor has to be applied on the
rated voltage:
+85°C to +105°C: 2.00% per °C for V
+85°C to +105°C: 1.25% per °C for V
Capacitance range:
1000 pF to 33µF
1000 pF to 2.2µF
Capacitance values:
E12 series (IEC 60063 Norm).
Capacitance tolerances (measured at 1 kHz):
±5% (J); ±10% (K); ±20% (M).
total self-inductance (L): (Lead length ~2 mm)
dissipation factor (dF):
tgδx10
Insulation resistance:
test voltage between terminations:
1.6xV
kHz
Pitch (mm)
100
test conditions
Temperature:
Voltage charge time: 1min
Voltage charge:
Performance
≥1x10
≥30000 s
* Typical value.
L (nH) ≈
10
1
R
-4
applied for 2 s at +25°C±5°C
at +25°C±5°C
C≤0.1µF
5
MΩ for C≤0.33µF (5x10
≤04
≤06
≤25
160Vdc - 250Vdc - 400Vdc - 630Vdc -1000Vdc
1250Vdc - 1600Vdc - 2000Vdc
for 1 section.
for 3 sections.
for C >0.33µF (150000 s)*
7.5
R
8
):
for 1 section.
for 3 sections.
0.1<C≤1.0
R
): +85°C
10
≤5
≤8
9
+25±C°5°C
100Vdc
µ
F
15
10
5
1<C≤4.7
MΩ)*
R
R
22.5
(d.c.)
(a.c.)
18
≤6
µ
F
27.5
18
C>4.7
≤10
37.5
20
µ
F
113
HIGH PERFORMANCES
MEtAllIzEd POlyPROPylENE FIlM CAPACItOR
d.C. ANd PUlSE APPlICAtIONS
PRODUCT CODE: R75 (digit 12: 0 to 9)
tESt MEtHOd ANd PERFORMANCE
damp heat, steady state:
Endurance:
Resistance to soldering heat:
long term stability (after two years):
test conditions
Temperature:
Relative humidity (RH):
Test duration:
Performance
Capacitance change |∆C/C|: ≤2%
DF change (∆tgδ):
Insulation resistance:
test conditions
Temperature:
Test duration:
Voltage applied:
Performance
Capacitance change |∆C/C|: ≤3%
DF change (∆tgδ):
Insulation resistance: ≥50% of initial limit.
test conditions
Solder bath temperature:
Dipping time (with heat screen):10 s±1 s
Performance
Capacitance change |∆C/C|: ≤1%
DF change (∆tgδ):
Insulation resistance:
Storage: standard environmental conditions (see page 12)
Performance
Capacitance change |∆C/C|: ≤0.5%
≤10x10
≤10x10
≤10x10
≤10x10
+40°C±2°C
93% ±2%
56 days
≤10x10
≥50% of initial limit.
+85°C±2°C
2000 h
1.25xV
+260°C±5°C
≥initial limit.
-4
-4
-4
-4
at 10kHz for C≤1µF
at 10kHz for C≤1µF
at 01kHz for C>1µF
at 01kHz for C>1µF
R
-4
at 1kHz
MKP Series
R75
09/2008

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