CWR11KH335KB Kemet, CWR11KH335KB Datasheet - Page 8

• Manufacturer Part Number: CWR11KH335KB
• Description: CAP TANT 3.3UF 25V 10% 2312
• Manufacturer: Kemet
• Series: Military, MIL-PRF-55365/8, CWR11r
• Type: Moldedr

Specifications of CWR11KH335KB

• Tolerance (+ Or -): 10%
• Voltage: 25VDC
• Esr: 3.5Ohm
• Mounting Style: Surface Mount
• Polarity: Polar
• Construction: SMT Chip
• Case Style: Molded
• Case Code: C
• Lead Spacing (nom): Not Requiredmm
• Df: 6%
• Dcl: 0.9uA
• Seal: Not Required
• Insulation: Not Required
• Failure Rate: B
• Wire Form: Not Required
• Product Length (mm): 6mm
• Product Height (mm): 2.5mm
• Product Depth (mm): 3.2mm
• Product Diameter (mm): Not Requiredmm
• Seated Plane Height: Not Requiredmm
• Length W/weld (max): Not Requiredmm
• Operating Temp Range: -55C to 125C
• Capacitance: 3.3uF
• Package / Case: 6032-28
• Voltage - Rated: 25V
• Tolerance: ±10%
• Esr (equivalent Series Resistance): 3.500 Ohm
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Size / Dimension: 0.236" L x 0.126" W (6.00mm x 3.20mm)
• Height - Seated (max): 0.110" (2.80mm)
• Lead Spacing: -
• Manufacturer Size Code: C
• Features: High Reliability
• Lifetime @ Temp.: -
• Lead Free Status / RoHS Status: Not Compliant

MIL-PRF (CWR Style) Established Reliability – T492 CWR11 Style Mil-PRF-55365/8
Reverse Voltage
Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. The
positive terminal is identified on the capacitor body by a stripe plus in some cases a beveled edge. A small degree of transient reverse
voltage is permissible for short periods per the table. The capacitors should not be operated continuously in reverse mode, even within
these limits.
Table 2 – Land Dimensions/Courtyard
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC standard 7351 (IPC-7351).
¹ Height of these chips may create problems in wave soldering.
² Land pattern geometry is too small for silkscreen outline.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
KEMET
Case
Temperature
C
D
A
B
125°C
25°C
85°C
7343-31
Metric
3216-18
3528-21
6032-28
Code
Size
EIA
1.35
2.35
2.35
2.55
Permissible Transient Reverse Voltage
X
Maximum (Most) Land
2.65
2.15
2.15
3.75
Density Level A:
Protrusion (mm)
Y
15% of Rated Voltage
5% of Rated Voltage
1% of Rated Voltage
2.60
1.45
1.45
2.70
C
10.20
8.90
6.10
6.10
V1
2.80
4.00
4.40
5.50
V2
1.25
2.25
2.25
2.45
X
Median (Nominal) Land
2.25
3.35
1.75
1.75
Density Level B:
Protrusion (mm)
Y
2.50
2.60
1.35
1.35
C
5.00
5.00
7.80
9.10
V1
3.90
2.30
3.50
5.00
V2
2.35
1.15
2.15
2.15
X
Minimum (Least) Land
1.35
1.35
1.85
2.95
Density Level C:
Protrusion (mm)
Y
T2006_T492 • 9/6/2011
1.25
1.25
2.40
2.50
C
6.90
8.20
4.10
4.10
V1
2.00
3.20
3.60
4.70
V2
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