TLP781(GB-TP6F-L Toshiba, TLP781(GB-TP6F-L Datasheet
TLP781(GB-TP6F-L
Specifications of TLP781(GB-TP6F-L
Related parts for TLP781(GB-TP6F-L
TLP781(GB-TP6F-L Summary of contents
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... Solid State Relays Switching Power Supplies Various Controllers Signal Transmission Between Different Voltage Circuits The TOSHIBA TLP781 consists of a silicone photo−transistor optically coupled to a gallium arsenide infrared emitting diode in a four lead plastic DIP (DIP4) with having high isolation voltage (AC: 5kV (min)). ...
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... Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). ...
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Recommended Operating Conditions Characteristic Supply voltage Forward current Collector current Operating temperature (Note): Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs ...
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... R = 100Ω off 1.9 kΩ OFF (Note 5): Switching time test circuit TLP781F(LF7) Unit in mm TOSHIBA ― Weight : 0.24g (typ.) 4 TLP781/TLP781F Min Typ. Max Unit ― 2 ― ― 3 ― ― 3 ― ― 3 ― ― 2 ― (Note 5) ― 25 ― ― 50 ― 4.5V 0.5V ...
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Specifications for Embossed-Tape Packing: (TP6), (TP7) 1. Applicable Package 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example 1) ＴＬＰ７８１（ＢＬ－ＴＰ６） (Example ...
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Tape Specification [1] TLP781 (TP6) (1)Tape material: Plastic (2)Dimensions: The tape dimensions are as shown in Figure 2. 0.33±0.02 φ1.5 φ1.5 4.2±0.1 [2] TLP781F (TP7) (1)Tape material: Plastic (2)Dimensions: The tape dimensions are as shown in Figure 3. 0.33±0.02 ...
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... The order code may be suffixed with wither a letter or a digit. Please contact your nearest Toshiba sales representative for more details. +2.0 16.4 -0 1.5± ...
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Soldering and Storage 1. Soldering 1.1 Soldering When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as much as possible by observing the following conditions. 1) Using solder reflow ·Temperature profile example ...
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Storage 1) Avoid storage locations where devices may be exposed to moisture or direct sunlight. 2) Follow the precautions printed on the packing label of the device for transportation and storage. 3) Keep the storage location temperature and humidity ...
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... EN60747 Isolation Characteristics Types: TLP781, TLP781F Type designations for ‘option: (D4) ’, which are tested under EN60747 requirements. Ex.: TLP781 (D4-GR-LF6) Note: Use TOSHIBA standard type number for safety standard application. Ex. TLP781 (D4-GR-LF6) → TLP781 Application classification for rated mains voltage ≤ 300 V rms for rated mains voltage ≤ ...
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Insulation Related Specifications Minimum creepage distance Minimum clearance Minimum insulation thickness Comparative tracking index ( printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.g.at a standard distance between soldering eye centres ...
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I – 100 - Ambient temperature Ta (℃ – I Δ / Δ F -3.0 -2.6 -2.2 -1.8 -1.4 -1.0 -0.6 0 Forward current I ...
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I – 0.1 0.01 0.001 0.0001 Ambient temperature Ta (℃) I – IF 0.0 0.2 0.4 0.6 ...
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I – 100 20mA 10mA 5mA 10 1mA 1 IF= 0.5 mA 0.1 0 -40 - Ambient temperature Ta (℃) Switching Time – R 1000 Ta = 25°C = 16mA ...
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... Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ...