TLP281-4 Toshiba, TLP281-4 Datasheet - Page 8

• Manufacturer Part Number: TLP281-4
• Description: Transistor Output Optocouplers 80Vceo 2500Vrms 4 channels
• Manufacturer: Toshiba

Specifications of TLP281-4

• Maximum Input Diode Current: 50 mA
• Maximum Reverse Diode Voltage: 5 V
• Output Device: Phototransistor
• Output Type: DC
• Configuration: 4 Channel
• Input Type: DC
• Maximum Collector Emitter Voltage: 80 V
• Maximum Collector Emitter Saturation Voltage: 0.2 V
• Isolation Voltage: 2500 Vrms
• Current Transfer Ratio: 600 %
• Maximum Forward Diode Voltage: 1.3 V
• Minimum Forward Diode Voltage: 1 V
• Maximum Collector Current: 50 mA
• Maximum Power Dissipation: 170 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 55 C
• Package / Case: SOP-16
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Soldering and Storage
1. Soldering
1) Using solder reflow
1.1 Soldering
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
3) Using a soldering iron
·Temperature profile example of lead (Pb) solder
·Temperature profile example of using lead (Pb)-free solder
・Please preheat it at 150°C between 60 and 120 seconds.
・Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may
be heated at most once.
(°C)
much as possible by observing the following conditions.
(°C)
240
210
160
140
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
260
230
190
180
60 to 120s
60 to 120s
Time
Time
less than 30s
30 to 50s
8
(s)
(s)
This profile is based on the device’s
value.
Set the preheat temperature/heating
type used by the customer within the
described profile.
maximum heat resistance guaranteed
temperature to the optimum temperature
corresponding to the solder paste
This profile is based on the device’s
value.
Set the preheat temperature/heating
type used by the customer within the
described profile.
maximum heat resistance guaranteed
temperature to the optimum temperature
corresponding to the solder paste
TLP285-4
2009-05-27