VO3063-X007T Vishay, VO3063-X007T Datasheet - Page 2

• Manufacturer Part Number: VO3063-X007T
• Description: Triac & SCR Output Optocouplers Zero Crossing Photo Triac 600V 5mA
• Manufacturer: Vishay

Specifications of VO3063-X007T

• Configuration: 1
• Maximum Continuous Output Current: 100 mA
• Maximum Input Current: 60 mA
• Maximum Operating Temperature: + 100 C
• Maximum Power Dissipation: 300 mW
• Maximum Reverse Diode Voltage: 6 V
• Minimum Operating Temperature: - 40 C
• Output Type: AC
• Package / Case: PDIP SMD
• Typical Input Voltage: 1.2 V
• Zero-crossing Circuit: Yes
• Output Device: Triac
• Isolation Voltage: 5300 Vrms
• Peak Output Voltage (vdrm): 600 V
• Maximum Input Voltage: 1.5 V
• Maximum Output Voltage: 420 VAC
• Minimum Trigger Current: 5 mA (Max)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

VO3062, VO3063
Vishay Semiconductors
Notes
(1)
(2)
Note
• The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the
www.vishay.com
2
ABSOLUTE MAXIMUM RATINGS
PARAMETER
OUTPUT
Off state output terminal voltage
Peak repetitive surge current
Power dissipation
On-state RMS current
COUPLER
Isolation test voltage
Total power dissipation
Operating temperature range
Storage temperature range
Soldering temperature
THERMAL CHARACTERISTICS
PARAMETER
Maximum LED junction temperature
Maximum output die junction temperature
Thermal resistance, junction emitter to board
Thermal resistance, junction emitter to case
Thermal resistance, junction detector to board
Thermal resistance, junction detector to case
Thermal resistance, junction emitter to
junction detector
Thermal resistance, case to ambient
ELECTRICAL CHARACTERISTCS (T
PARAMETER
INPUT
Reverse current
Forward voltage
OUTPUT
Leakage with LED off, either
direction
Critical rate of rise off-state voltage
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
maximum ratings for extended periods of the time can adversely affect reliability.
Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through
hole devices (DIP).
temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of
PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay’s Thermal
Characteristics of Optocouplers application note.
(2)
For technical questions, contact:
Phototriac, Zero Crossing, 1.5 kV/μs dV/dt,
TEST CONDITION
PW = 100 μs, 120 pps
TEST CONDITION
V
(1)
maximum ≤ 10 s
I
DRM
V
SYMBOL
F
V
D
amb
= 30 mA
(T
T
T
R
θ
θ
θ
θ
= 400 V
θ
θ
jmax.
jmax.
t = 1 s
JEC
JDB
JDC
JED
= 6 V
JEB
= 600 V
CA
amb
= 25 °C, unless otherwise specified)
= 25 °C, unless otherwise specified)
VALUE
3563
125
125
150
139
103
496
78
[e-mail]
600 V
VO3062, VO3063
PART
PART
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
°C
SYMBOL
dV/dt
I
DRM
V
I
R
F
SYMBOL
I
V
T(RMS)
P
T
I
V
P
T
T
TSM
DRM
amb
diss
ISO
stg
sld
tot
T
MIN.
1500
19996
JD
θ
DB
θ
DC
- 40 to + 100
- 55 to + 150
TYP.
2000
T
T
T
VALUE
B
1.2
C
A
θ
10
5300
DE
Document Number: 83748
600
200
100
300
260
1
T
θ
θ
A
CA
BA
Package
θ
Rev. 1.9, 20-Oct-10
EC
MAX.
θ
EB
500
1.5
10
T
JE
UNIT
V
mW
mW
mA
RMS
°C
°C
°C
V
A
UNIT
V/μs
μA
nA
V