EFM32-TG840F32-SK Energy Micro, EFM32-TG840F32-SK Datasheet - Page 56
![MCU, MPU & DSP Development Tools TG840 Sample Kit](/photos/26/92/269217/largeenergymicroefm32mcu_sml.jpg)
EFM32-TG840F32-SK
Manufacturer Part Number
EFM32-TG840F32-SK
Description
MCU, MPU & DSP Development Tools TG840 Sample Kit
Manufacturer
Energy Micro
Datasheet
1.EFM32-TG840F32-SK.pdf
(66 pages)
Specifications of EFM32-TG840F32-SK
Processor To Be Evaluated
EFM32
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EFM32-TG840F32-SK
Manufacturer:
EnergyMi
Quantity:
17
5.2 Soldering Information
2012-02-27 - EFM32TG840FXX - d0011_Rev0.95
Figure 5.3. QFN64 PCB Stencil Design
Table 5.3. QFN64 PCB Stencil Design Dimensions (Dimensions in mm)
1. The drawings are not to scale.
2. All dimensions are in millimeters.
3. All drawings are subject to change without notice.
4. The PCB Land Pattern drawing is in compliance with IPC-7351B.
5. Stencil thickness 0.125 mm.
The latest IPC/JEDEC J-STD-020 recommendations for Pb-Free reflow soldering should be followed.
The packages have a Moisture Sensitivity Level rating of 3, please see the latest IPC/JEDEC J-STD-033
standard for MSL description and level 3 bake conditions.
Symbol
a
b
c
d
b
c
Dim. (mm)
a
0.85
0.30
0.50
8.90
x
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56
d
z
y
Symbol
e
x
y
z
www.energymicro.com
e
Dim. (mm)
8.90
2.70
2.70
0.80