EFM32-TG210F32-SK Energy Micro, EFM32-TG210F32-SK Datasheet - Page 60

• Manufacturer Part Number: EFM32-TG210F32-SK
• Description: MCU, MPU & DSP Development Tools TG210 Sample Kit
• Manufacturer: Energy Micro

Specifications of EFM32-TG210F32-SK

• Processor To Be Evaluated: EFM32
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

...the world's most energy friendly microcontrollers
List of Tables
1.1. Ordering Information ................................................................................................................................ 2
2.1. Configuration Summary ............................................................................................................................ 7
3.1. Absolute Maximum Ratings ...................................................................................................................... 9
3.2. General Operating Conditions ................................................................................................................... 9
3.3. Environmental ....................................................................................................................................... 10
3.4. Current Consumption ............................................................................................................................. 11
3.5. Energy Modes Transitions ...................................................................................................................... 13
3.6. Power Management ............................................................................................................................... 13
3.7. Flash .................................................................................................................................................. 14
3.8. GPIO .................................................................................................................................................. 15
3.9. LFXO .................................................................................................................................................. 22
3.10. Minimum Load Capacitance (C
) Requirement For Safe Crystal Startup ................................................... 22
LFXOL
3.11. HFXO ................................................................................................................................................ 23
3.12. LFRCO .............................................................................................................................................. 23
3.13. HFRCO ............................................................................................................................................. 24
3.14. ULFRCO ............................................................................................................................................ 24
3.15. ADC .................................................................................................................................................. 25
3.16. DAC .................................................................................................................................................. 33
3.17. OPAMP ............................................................................................................................................. 34
3.18. ACMP ............................................................................................................................................... 39
3.19. VCMP ............................................................................................................................................... 41
3.20. Digital Peripherals ............................................................................................................................... 41
4.1. Device Pinout ....................................................................................................................................... 43
4.2. Alternate functionality overview ................................................................................................................ 45
4.3. GPIO Pinout ........................................................................................................................................ 47
4.4. QFN32 (Preliminary) (Dimensions in mm) .................................................................................................. 49
5.1. QFN32 PCB Land Pattern Dimensions (Dimensions in mm) .......................................................................... 50
5.2. QFN32 PCB Solder Mask Dimensions (Dimensions in mm) ........................................................................... 51
5.3. QFN32 PCB Stencil Design Dimensions (Dimensions in mm) ........................................................................ 52
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2012-02-27 - EFM32TG210FXX - d0012_Rev0.95
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