TGS2306 TriQuint, TGS2306 Datasheet - Page 7

• Manufacturer Part Number: TGS2306
• Description: Wireless Accessories DC - 18 GHz SPDT Switch
• Manufacturer: TriQuint

Specifications of TGS2306

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1023348

TriQuint Semiconductor Texas Phone: [phone] Fax: [phone] Email: [e-mail] Web: www.triquint.com
For optimum insertion loss and return loss, a single 0.001” bondwire of length
35 mils should be used. This will be approximately 0.42nH. Differences in
bondwire length will have an impact on switch performance.
V
DC blocks are required for the RF input and output.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
C1
& V
C2
can be applied from either side of the MMIC.
Chip Assembly & Bonding Diagram
Advance Product Information
November 9, 2004
TGS2306-EPU
7