TGA4802 TriQuint, TGA4802 Datasheet - Page 10

• Manufacturer Part Number: TGA4802
• Description: Wireless Accessories 12.5GB/s RZ Modulator Driver
• Manufacturer: TriQuint

Specifications of TGA4802

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1009427

TriQuint Semiconductor Texas Phone: [phone] Fax: [phone] Email: [e-mail] Web: www.triquint.com
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice
Assembly Notes:
Reflow Attachment:
Adhesive Attachment:
Component Pickup and Placement:
Interconnect:
Use AuSn (80/20) solder with limited exposure to temperatures at or above 300 C
Use alloy station or conveyor furnace with reducing atmosphere
No fluxes should be utilized
Coefficient of thermal expansion matching is critical for long-term reliability
Storage in dry nitrogen atmosphere
Organic attachment can be used in low-power applications
Curing should be done in a convection oven; proper exhaust is a safety concern
Microwave or radiant curing should not be used because of differential heating
Coefficient of thermal expansion matching is critical
Vacuum pencil and/or vacuum collet preferred method of pick up
Avoidance of air bridges during placement
Force impact critical during auto placement
Thermosonic ball bonding is the preferred interconnect technique
Force, time, and ultrasonics are critical parameters
Aluminum wire should not be used
Discrete FET devices with small pad sizes should be bonded with 0.0007-inch wire
Maximum stage temperature: 200 C
Evaluation Platform Assembly Notes
Advance Product Information
TGA4802EPU
July 22, 2004
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