TGS2302 TriQuint, TGS2302 Datasheet - Page 7

• Manufacturer Part Number: TGS2302
• Description: Wireless Accessories 4-20GHz SPDT VPIN Switch
• Manufacturer: TriQuint

Specifications of TGS2302

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1032682

TriQuint Semiconductor Texas: www.triquint.com Phone [phone] Fax [phone] [e-mail]
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
0.000 [0.000]
1.630 [0.064]
1.447 [0.056]
0.676 [0.026]
0.000 [0.000]
Units: millimeters (inches)
Thickness: 0.100 (0.004)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size tolerance: +/- 0.051 (0.002)
GND IS BACKSIDE OF MMIC
Bond pad #1
Bond pad #2
Bond pad #3
Bond pad #4
Bond pad #5
TQS 2006
1
0.173 [0.007]
A
DIOD
E
T
EST
VPIN
RC
A
(RF Output A)
(RF Input)
(Icontrol-A)
(Icontrol-B)
(RF Output B)
Mechanical Drawing
1.118 [0.044]
RC
A
2
0.193 x 0.243 (0.008 x 0.010)
0.243 x 0.193 (0.010 x 0.008)
0.193 x 0.243 (0.008 x 0.010)
0.105 x 0.132 (0.004 x 0.005)
0.105 x 0.132 (0.004 x 0.005)
2.062 [0.080]
2.106 [0.082]
2.240 [0.087]
5
3
4
1.478 [0.058]
0.975 [0.038]
0.676 [0.026]
TGS2302
May 2008
7