LSDEV-WI01-A20 LS Research, LSDEV-WI01-A20 Datasheet - Page 5

• Manufacturer Part Number: LSDEV-WI01-A20
• Description: WiFi / 802.11 Modules & Development Tools TiWi RF Dev Kit
• Manufacturer: LS Research

Specifications of LSDEV-WI01-A20

• Wireless Frequency: 2412 MHz to 2472 MHz
• Interface Type: SDIO
• Modulation: GFSK, CCK, OFDM
• Operating Voltage: 3 V to 4.8 V
• Output Power: 12.5 dBm to 20 dBm
• Antenna: U.FL Connector for External Antenna (Not Included)
• Operating Temperature Range: - 40 C to + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

APPLICATION SCHEMATIC ............................................................................................. 24
SOLDERING RECOMMENDATIONS ................................................................................ 25
SHIPPING, HANDLING, AND STORAGE ......................................................................... 26
AGENCY CERTIFICATIONS ............................................................................................. 26
MECHANICAL DATA......................................................................................................... 27
MODULE REVISION HISTORY ......................................................................................... 30
CONTACTING LS RESEARCH ......................................................................................... 31
The information in this document is subject to change without notice.
Confirm the data is current by downloading the latest revision from www.lsr.com.
330-0041-Rev2.4
Recommended Reflow Profile ................................................................................................................. 25
Lead (Pb) Free Soldering Paste ............................................................................................................... 25
Cleaning ..................................................................................................................................................... 25
Optical Inspection ..................................................................................................................................... 25
Repeating Reflow Soldering .................................................................................................................... 25
Wave Soldering ......................................................................................................................................... 26
Hand Soldering .......................................................................................................................................... 26
Rework ....................................................................................................................................................... 26
Additional Grounding ............................................................................................................................... 26
Shipping ..................................................................................................................................................... 26
Handling ..................................................................................................................................................... 26
Moisture Sensitivity Level (MSL) ............................................................................................................. 26
Storage ....................................................................................................................................................... 26
Rev A .......................................................................................................................................................... 30
Copyright © 2010 LS Research, LLC
TiWi-R1 TRANSCEIVER MODULE
DATASHEET
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