MCU08050D1002BP500 Vishay, MCU08050D1002BP500 Datasheet - Page 8

• Manufacturer Part Number: MCU08050D1002BP500
• Description: MCU 0805-25 0.1% P5 10K
• Manufacturer: Vishay
• Series: MCU 0805r

Specifications of MCU08050D1002BP500

• Resistance (ohms): 10K
• Number Of Terminations: 2
• Package / Case: 0805 (2012 Metric)
• Power (watts): 0.125W, 1/8W
• Composition: Thin Film
• Temperature Coefficient: ±25ppm/°C
• Tolerance: ±0.1%
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height: 0.018" (0.45mm)
• Lead Style: Surface Mount (SMD - SMT)
• Resistance In Ohms: 10.0K
• Case: 0805 (2012 metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 2312 256 71003; 2312 256 71003; 231225671003; MCU0805-10K-DBTR

Notes
(1)
(2)
Document Number: 28700
Revision: 18-Dec-09
TEST PROCEDURES AND REQUIREMENTS
4.17.2
4.18.2
4.29
4.32
4.33
4.7
4.35
Special requirements for type MCA 1206
4.25.1
CLAUSE
60115-1
See 4.25.1 (above): special requirements for type MCA 1206
The pulse load stability of professional MFC resistors applies for precision resistors also. However, severe pulse loads are likely to jeopardise
precision stability requirements.
EN
METHOD
60068-2
21 (Ue
21 (Ue
45 (XA)
58 (Td)
58 (Td)
TEST
IEC
-
-
-
-
3
1
)
)
MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Precision
operation mode
operation mode
soldering heat
Resistance to
Endurance at
Endurance at
Voltage proof
Flammability
Solderability
Component
(adhesion)
resistance
Substrate
Precision
Standard
bending
solvent
Shear
70 °C:
70 °C:
TEST
For technical questions, contact:
Precision Thin Film Chip Resistors
whichever is the less severe;
whichever is the less severe;
U =
U =
Stability for product types:
SnPb40; non-activated flux
RR 1005M and RR 1608M;
RR 2012M and RR 3216M;
Isopropyl alcohol + 50 °C;
SnAg3Cu0.5 or SnAg3.5;
(215 ± 3) °C; (3 ± 0.3) s
(235 ± 3) °C; (2 ± 0.2) s
(260 ± 5) °C; (10 ± 1) s
U
needle flame test; 10 s
Depth 2 mm, 3 times
Solder bath method;
Solder bath method;
Solder bath method;
RMS
non-activated flux
P
P
PROCEDURE
IEC 60695-2-2,
70 °C; 1000 h
70 °C; 8000 h
70 °C; 1000 h
70 °C; 8000 h
70
70
= U
method 2
x R
x R
45 N
9 N
ins
; (60 ± 5) s
or U = U
or U = U
MCU 0805
MCA 1206
MCS 0402
MCT 0603
max.
max.
[e-mail]
;
;
STABILITY CLASS 0.1
no visible damage, no open circuit in bent position
100 Ω to 47.5 kΩ
470 Ω to 10 kΩ
100 Ω to 10 kΩ
47 Ω to 332 kΩ
Good tinning (≥ 95 % covered);
PERMISSIBLE CHANGE (ΔR)
No flashover or breakdown
± (0.05 % R + 0.01 Ω)
± (0.05 % R + 0.01 Ω)
± (0.05 % R + 0.02 Ω)
± (0.25 % R + 0.05 Ω)
No burning after 30 s
± (0.1 % R + 0.02 Ω)
± (0.1 % R + 0.02 Ω)
No visible damage
No visible damage
REQUIREMENTS
no visible damage
Vishay Beyschlag
STABILITY CLASS 0.25
> 47.5 kΩ to 1.5 MΩ
> 10 kΩ to 52.3 kΩ
> 10 kΩ to 511 kΩ
> 332 kΩ to 2 MΩ
39 Ω to < 100 Ω;
39 Ω to < 100 Ω;
39 Ω to < 47 Ω;
www.vishay.com
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