BZX84C6V8LT1G ON Semiconductor, BZX84C6V8LT1G Datasheet - Page 5

• Manufacturer Part Number: BZX84C6V8LT1G
• Description: DIODE ZENER 6.8V 225MW SOT-23
• Manufacturer: ON Semiconductor
• Type: Voltage Regulatorr

Specifications of BZX84C6V8LT1G

• Voltage - Zener (nom) (vz): 6.8V
• Voltage - Forward (vf) (max) @ If: 900mV @ 10mA
• Current - Reverse Leakage @ Vr: 2µA @ 4V
• Power - Max: 225mW
• Impedance (max) (zzt): 15 Ohm
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Operating Temperature: -65°C ~ 150°C
• Zener Voltage: 6.8 V
• Voltage Tolerance: 6 %
• Voltage Temperature Coefficient: 2.85 mV / K
• Zener Current: 10 mA
• Power Dissipation: 300 mW
• Maximum Reverse Leakage Current: 2 uA
• Maximum Zener Impedance: 15 Ohms
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 65 C
• Capacitance, Junction: 155 pF
• Current, Forward: 10 mA
• Current, Reverse: 5 mA
• Package Type: SOT-23 (TO-236)
• Primary Type: Zener
• Temperature, Junction, Maximum: +150 °C
• Temperature, Operating: -65 to +150 °C
• Voltage, Forward: 0.9 V
• Voltage, Reverse: 6.8 V
• Configuration: Single
• Zener Voltage (typ): 6.8V
• Zener Test Current: 5mA
• Knee Impedance: 15Ohm
• Operating Temperature Classification: Military
• Rev Curr: 2uA
• Mounting: Surface Mount
• Pin Count: 3
• Operating Temp Range: -65C to 150C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Tolerance: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: BZX84C6V8LT1GOSTR

A
A1
E
1
3
D
e
2
b
H
E
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BZX84B4V7LT1, BZX84C2V4LT1 Series
SEE VIEW C
0.037
0.95
0.035
0.9
0.031
0.8
PACKAGE DIMENSIONS
VIEW C
SOLDERING FOOTPRINT*
L1
L
SOT-23 (TO-236)
CASE 318-08
ISSUE AN
q
0.25
c
7
0.037
0.95
SCALE 10:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. 318-01 THRU -07 AND -09 OBSOLETE, NEW
0.079
2.0
STYLE 8:
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
STANDARD 318-08.
DIM
A1
H
PIN 1. ANODE
L1
A
b
D
E
c
e
L
E
2. NO CONNECTION
3. CATHODE
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
inches
mm
MILLIMETERS
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
MAX
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
1.11
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
MIN
INCHES
0.040
0.002
0.018
0.005
0.051
0.075
0.008
0.021
0.094
NOM
0.114
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
MAX