BZX84C6V8LT1G ON Semiconductor, BZX84C6V8LT1G Datasheet - Page 5
BZX84C6V8LT1G
Manufacturer Part Number
BZX84C6V8LT1G
Description
DIODE ZENER 6.8V 225MW SOT-23
Manufacturer
ON Semiconductor
Type
Voltage Regulatorr
Specifications of BZX84C6V8LT1G
Voltage - Zener (nom) (vz)
6.8V
Voltage - Forward (vf) (max) @ If
900mV @ 10mA
Current - Reverse Leakage @ Vr
2µA @ 4V
Power - Max
225mW
Impedance (max) (zzt)
15 Ohm
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Operating Temperature
-65°C ~ 150°C
Zener Voltage
6.8 V
Voltage Tolerance
6 %
Voltage Temperature Coefficient
2.85 mV / K
Zener Current
10 mA
Power Dissipation
300 mW
Maximum Reverse Leakage Current
2 uA
Maximum Zener Impedance
15 Ohms
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Capacitance, Junction
155 pF
Current, Forward
10 mA
Current, Reverse
5 mA
Package Type
SOT-23 (TO-236)
Primary Type
Zener
Temperature, Junction, Maximum
+150 °C
Temperature, Operating
-65 to +150 °C
Voltage, Forward
0.9 V
Voltage, Reverse
6.8 V
Configuration
Single
Zener Voltage (typ)
6.8V
Zener Test Current
5mA
Knee Impedance
15Ohm
Operating Temperature Classification
Military
Rev Curr
2uA
Mounting
Surface Mount
Pin Count
3
Operating Temp Range
-65C to 150C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Tolerance
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
BZX84C6V8LT1GOSTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BZX84C6V8LT1G
Manufacturer:
ON Semiconductor
Quantity:
197 242
Company:
Part Number:
BZX84C6V8LT1G
Manufacturer:
ON Semiconductor
Quantity:
1 950
Company:
Part Number:
BZX84C6V8LT1G
Manufacturer:
ON
Quantity:
30 000
Company:
Part Number:
BZX84C6V8LT1G
Manufacturer:
ON
Quantity:
30 000
Part Number:
BZX84C6V8LT1G
Manufacturer:
ON/安森美
Quantity:
20 000
A
A1
E
1
3
D
e
2
b
H
E
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BZX84B4V7LT1, BZX84C2V4LT1 Series
SEE VIEW C
0.037
0.95
0.035
0.9
0.031
0.8
PACKAGE DIMENSIONS
VIEW C
SOLDERING FOOTPRINT*
L1
L
SOT-23 (TO-236)
CASE 318-08
ISSUE AN
q
0.25
c
7
0.037
0.95
SCALE 10:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. 318-01 THRU -07 AND -09 OBSOLETE, NEW
0.079
2.0
STYLE 8:
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
STANDARD 318-08.
DIM
A1
H
PIN 1. ANODE
L1
A
b
D
E
c
e
L
E
2. NO CONNECTION
3. CATHODE
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
inches
mm
MILLIMETERS
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
MAX
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
1.11
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
MIN
INCHES
0.040
0.002
0.018
0.005
0.051
0.075
0.008
0.021
0.094
NOM
0.114
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
MAX