BZT52H-C22,115 NXP Semiconductors, BZT52H-C22,115 Datasheet - Page 9

• Manufacturer Part Number: BZT52H-C22,115
• Description: DIODE ZENER 22V 375MW SOD123F
• Manufacturer: NXP Semiconductors

Specifications of BZT52H-C22,115

• Package / Case: SOD-123 Flat Leads
• Voltage - Zener (nom) (vz): 22V
• Voltage - Forward (vf) (max) @ If: 900mV @ 10mA
• Current - Reverse Leakage @ Vr: 50nA @ 15.4V
• Tolerance: ±5%
• Power - Max: 375mW
• Impedance (max) (zzt): 25 Ohm
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 150°C
• Zener Voltage: 22.05 V
• Voltage Tolerance: 6 %
• Voltage Temperature Coefficient: 18.2 mV / K
• Power Dissipation: 830 mW
• Maximum Reverse Leakage Current: 0.05 uA
• Maximum Zener Impedance: 25 Ohms
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 65 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-3760-2; 934059411115; BZT52H-C22 T/R

NXP Semiconductors
11. Soldering
BZT52H_SER
Product data sheet
Fig 6.
2.1
Reflow soldering is the only recommended soldering method.
Dimensions in mm.
Reflow soldering footprint SOD123F
1.6
All information provided in this document is subject to legal disclaimers.
(2×)
1.1
Rev. 3 — 7 December 2010
4.4
2.9
1.6
4
Single Zener diodes in a SOD123F package
1.1 1.2
BZT52H series
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
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