LTM9002IV-AA#PBF Linear Technology, LTM9002IV-AA#PBF Datasheet - Page 27

• Manufacturer Part Number: LTM9002IV-AA#PBF
• Description: MS-uModule, 14-bit, Dual IF/Baseband Receiver Module, 125Msps, DC-170MHz LPF, 26
• Manufacturer: Linear Technology

PACKAGE DESCRIPTION
CORNER
PAD 1
4
aaa Z
5.080
3.810
2.540
1.270
0.000
1.270
2.540
3.810
5.080
SUGGESTED PCB LAYOUT
PACKAGE TOP VIEW
TOP VIEW
BSC
15
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
X
11.25
BSC
Y
108-Lead (15mm × 11.25mm × 2.32mm)
(Reference LTC DWG # 05-08-1757 Rev Ø)
aaa Z
0.630 ±0.025 SQ. 108x
1.95 – 2.05
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
3
4
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. THE TOTAL NUMBER OF PADS: 108
SYMBOL
bbb
aaa
eee
LAND DESIGNATION PER JESD MO-222, SPP-010
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DETAIL A
DETAIL B
MOLD
TOLERANCE
CAP
eee
0.15
0.10
0.05
LGA Package
S
SUBSTRATE
X
Y
0.27 – 0.37
2.22 – 2.42
DETAIL B
SEE NOTES
3
10.16
BSC
PADS
TRAY PIN 1
1.27
BSC
COMPONENT
PIN “A1”
BEVEL
12
11
10
9
PACKAGE IN TRAY LOADING ORIENTATION
PACKAGE BOTTOM VIEW
LTMXXXXXX
μModule
8
7
13.97
BSC
6
5
LTM9002
4
3
2
DETAIL A
LGA 108 0707 REV Ø
1
27
J
H
G
F
E
D
C
B
A
DIA (0.635)
PAD 1
0.22 × 45°
CHAMFER
9002f