AD5271BCPZ-20-RL7 Analog Devices Inc, AD5271BCPZ-20-RL7 Datasheet - Page 9

• Manufacturer Part Number: AD5271BCPZ-20-RL7
• Description: 256 Tap 5v 50tp, 1% R-tol MSOP SPI I.C.
• Manufacturer: Analog Devices Inc

Specifications of AD5271BCPZ-20-RL7

• Resistance (ohms): 20K
• Taps: 256
• Number Of Circuits: 1
• Temperature Coefficient: 5 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 5.5 V, ±2.5 V ~ 2.75 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: AD5271BCPZ-20-RL7; AD5271BCPZ-20-RL7TR

ABSOLUTE MAXIMUM RATINGS
T
Table 8.
Parameter
V
V
V
V
Digital Input and Output Voltage to GND
EXT_CAP to V
I
Operating Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Reflow Soldering
Package Power Dissipation
1
2
3
4
A
Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A and W terminals at a given
resistance.
Maximum continuous current.
Pulse duty factor.
Includes programming of 50-TP memory.
DD
SS
DD
A
A
, I
, V
Continuous
Pulsed
(T
Peak Temperature
Time at Peak Temperature
W
= 25°C, unless otherwise noted.
to GND
to GND
to V
J
W
R
R
Frequency > 10 kHz
Frequency ≤ 10 kHz
Maximum)
AW
AW
to GND
SS
= 20 kΩ
= 50 kΩ, 100 kΩ
1
SS
4
Rating
–0.3 V to +7.0 V
+0.3 V to −7.0 V
7 V
V
−0.3 V to V
7 V
±3 mA
±2 mA
±MCC
±MCC
−40°C to +125°C
150°C
−65°C to +150°C
260°C
20 sec to 40 sec
(T
SS
J
− 0.3 V, V
max − T
2
2
/√d
/d
3
3
DD
A
DD
)/θ
+ 0.3 V
+ 0.3 V
JA
Rev. E | Page 9 of 24
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
dependent on the test board and test environment.
Table 9. Thermal Resistance
Package Type
10-Lead LFCSP
10-Lead MSOP
1
ESD CAUTION
JEDEC 2S2P test board, still air (0 m/s air flow).
JA
is defined by JEDEC specification JESD-51 and the value is
θ
50
135
JA
1
AD5270/AD5271
θ
3
N/A
JC
Unit
°C/W
°C/W