AD7394ARZ-REEL7 Analog Devices Inc, AD7394ARZ-REEL7 Datasheet - Page 5

• Manufacturer Part Number: AD7394ARZ-REEL7
• Description: X2, 12-Bit, +3V UPwr DAC
• Manufacturer: Analog Devices Inc

Specifications of AD7394ARZ-REEL7

• Settling Time: 60µs
• Number Of Bits: 12
• Data Interface: Serial
• Number Of Converters: 2
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 1mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7394/AD7395 features proprietary ESD protection circuitry, permanent dam-
age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
Model
AD7394AN
AD7394AR
AD7395AN
AD7395AR
AD7395ARU
The AD7394/AD7395 contains 709 transistors. The die size measures 70 mil
REV. 0
ABSOLUTE MAXIMUM RATINGS*
V
V
Logic Inputs to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V
V
I
Package Power Dissipation . . . . . . . . . . . . . (T
Thermal Resistance
Maximum Junction Temperature (T
OUT
DD
REF
OUT
AD7394
AD7395
14-Lead Plastic DIP Package (N-14) . . . . . . . . . . 103 C/W
14-Lead SOIC Package (R-14) . . . . . . . . . . . . . . . 158 C/W
14-Lead Thin Shrink Surface Mount (RU-14) . . . 180 C/W
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7 V
Short Circuit to GND . . . . . . . . . . . . . . . . . . . . . 50 mA
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
MSB
B11
D11
MSB
B9
D9
Table III. AD7395 Serial Input Register Data Format, Data Is Loaded in MSB-First Format
Table II. AD7394 Serial Input Register Data Format, Data Is Loaded in MSB-First Format
Res
(LSB)
12
12
10
10
10
JA
B10
D10
B8
D8
Temperature
Range
–40 C to +85 C
–40 C to +85 C
–40 C to +125 C
–40 C to +125 C
–40 C to +85 C
J
B9
D9
B7
D7
max) . . . . . . . . . . 150 C
B8
D8
B6
D6
J
max – T
DD
ORDERING GUIDE
+ 0.3 V
B7
D7
B5
D5
A
)/
DD
Package
Description
14-Lead P-DIP
14-Lead SOIC
14-Lead P-DIP
14-Lead SOIC
14-Lead Thin Shrink Small Outline Package (TSSOP)
JA
99 mil.
–5–
B6
D6
B4
D4
Operating Temperature Range . . . . . . . . . . . –40 C to +85 C
Storage Temperature Range . . . . . . . . . . . . –65 C to +150 C
Lead Temperature
*Stresses above those listed under Absolute Maximum Ratings
permanent damage to the device. This is a stress rating only; functional operation
of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
N-14 (Soldering, 10 sec) . . . . . . . . . . . . . . . . . . . . . . +300 C
R-14 (Vapor Phase, 60 sec) . . . . . . . . . . . . . . . . . . . . +215 C
RU-14 (Infrared, 15 sec) . . . . . . . . . . . . . . . . . . . . . . +224 C
AD7395AR and AD7395AN Only . . . . . . –40 C to +125 C
B5
D5
B3
D3
B4
D4
B2
D2
B3
D3
B1
D1
WARNING!
AD7394/AD7395
B2
D2
LSB
B0
D0
ESD SENSITIVE DEVICE
B1
D1
Package
N-14
N-14
RU-14
Options
R-14
R-14
may cause
LSB
B0
D0