AD7862AR-10 Analog Devices Inc, AD7862AR-10 Datasheet - Page 3

• Manufacturer Part Number: AD7862AR-10
• Description: A/D Converter (A-D) IC
• Manufacturer: Analog Devices Inc

Specifications of AD7862AR-10

• No. Of Bits: 12 Bit
• Mounting Type: Surface Mount
• Features: Dual, Simultaneous Sampling
• No. Of Channels: 2
• Interface Type: Parallel
• Package / Case: 28-SOIC
• Rohs Status: RoHS non-compliant
• Number Of Bits: 12
• Sampling Rate (per Second): 250k
• Data Interface: Parallel
• Number Of Converters: 2
• Power Dissipation (max): 75mW
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Number Of Elements: 2
• Resolution: 12Bit
• Architecture: SAR
• Sample Rate: 250KSPS
• Input Polarity: Bipolar
• Input Type: Voltage
• Rated Input Volt: ±10V
• Differential Input: No
• Power Supply Requirement: Analog and Digital
• Single Supply Voltage (typ): 5V
• Single Supply Voltage (min): 4.75V
• Single Supply Voltage (max): 5.25V
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Power Dissipation: 75mW
• Differential Linearity Error: ±1LSB
• Integral Nonlinearity Error: ±1LSB
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 28
• Package Type: SOIC W
• Input Signal Type: Single-Ended
• Lead Free Status / Rohs Status: Not Compliant

Model
AD7862AR-10
AD7862BR-10
AD7862ARS-10
AD7862AN-10
AD7862SQ-10
AD7862AR-3
AD7862BR-3
AD7862ARS-3
AD7862AN-3
AD7862AR-2
AD7862ARS-2
REV. 0
Parameter
LOGIC OUTPUTS
CONVERSION RATE
POWER REQUIREMENTS
NOTES
1
2
3
ABSOLUTE MAXIMUM RATINGS*
(T
V
V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog Input Voltage to AGND
Reference Input Voltage to AGND . . . –0.3 V to V
Digital Input Voltage to DGND . . . . . –0.3 V to V
Digital Output Voltage to DGND . . . . –0.3 V to V
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65 C to +150 C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150 C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 670 mW
Temperature ranges are as follows: A, B Versions: –40 C to +85 C;
S Version: –55 C to +125 C.
See Terminology.
Performance measured through full channel (multiplexer, SHA and ADC).
DD
DD
Output High Voltage, V
Output Low Voltage, V
DB11–DB0
Output Coding
Conversion Time
Track/Hold Acquisition Time
V
I
Power Dissipation
A
AD7862-10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AD7862-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AD7862-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V
Commercial (A, B Version) . . . . . . . . . . . –40 C to +85 C
Extended (S Version) . . . . . . . . . . . . . . . . –55 C to +125 C
DD
DD
= +25 C unless otherwise noted)
JA
Floating-State Leakage Current
Floating-State Capacitance
AD7862-10, AD7862-3
AD7863-2
Normal Mode
Standby Mode
Normal Mode
Standby Mode
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 116 C/W
Input
0 V to 2.5 V
0 V to 2.5 V
Input
10 V
10 V
10 V
10 V
10 V
2.5 V
2.5 V
2.5 V
2.5 V
OL
OH
4
2, 3
Relative
Accuracy
1 LSB
1 LSB
1 LSB
1 LSB
1 LSB
1 LSB
1 LSB
1 LSB
1 LSB
1 LSB
1 LSB
A
Version
4.0
0.4
10
3.6
0.3
+5
15
25
75
125
10
1
DD
DD
DD
B
Version
4.0
0.4
10
3.6
0.3
+5
15
25
75
125
ORDERING GUIDE
+ 0.3 V
+ 0.3 V
+ 0.3 V
Temperature
Range
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–55 C to +125 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
10
0.3 V
17 V
7 V
4
Specifications subject to change without notice.
Sample tested @ +25 C to ensure compliance.
–3–
Ceramic DIP Package, Power Dissipation . . . . . . . . . 670 mW
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
SSOP Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
*Stresses above those listed under “Absolute Maximum Ratings” may cause
S
Version
4.0
0.4
10
3.6
0.3
+5
15
25
75
125
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
10
Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260 C
Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260 C
Lead Temperature, Soldering
Lead Temperature, Soldering
JA
JA
JA
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 116 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 110 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 110 C/W
Package
Description
28-Bit Small Outline Package
28-Bit Small Outline Package
28-Bit Shrink Small Outline Package
28-Bit Plastic DIP
28-Bit Cerdip
28-Bit Small Outline Package
28-Bit Small Outline Package
28-Bit Shrink Small Outline Package
28-Plastic DIP
28-Bit Small Outline Package
28-Bit Shrink Small Outline Package
Units
V min
V max
pF max
V nom
mA max
mW max
A max
s max
s max
A max
W max
Test Conditions/Comments
I
I
Twos Complement
Straight (Natural) Binary
For Both Channels
Logic Inputs = 0 V or V
Typically 60 mW
Typically 75 W
SOURCE
SINK
5% for Specified Performance
= 1.6 mA
= 200 A
AD7862
Package
Option
R-28
R-28
RS-28
N-28
Q-28
R-28
R-28
RS-28
N-28
R-28
RS-28
DD