AD8310ARMZ-REEL7 Analog Devices Inc, AD8310ARMZ-REEL7 Datasheet - Page 22

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AD8310ARMZ-REEL7

Manufacturer Part Number
AD8310ARMZ-REEL7
Description
IC,Log/Antilog Amplifier,SINGLE,BIPOLAR,TSSOP,8PIN,PLASTIC
Manufacturer
Analog Devices Inc
Type
Logarithmic Amplifierr
Datasheet

Specifications of AD8310ARMZ-REEL7

Applications
Receiver Signal Strength Indication (RSSI)
Mounting Type
Surface Mount
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Number Of Channels
1
Number Of Elements
6
Power Supply Requirement
Single
Input Resistance
0.0012@5VMohm
Single Supply Voltage (typ)
3/5V
Dual Supply Voltage (typ)
Not RequiredV
Power Dissipation
200mW
Rail/rail I/o Type
Rail to Rail Input
Single Supply Voltage (min)
2.7V
Single Supply Voltage (max)
5.5V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Package Type
MSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD8310ARMZ-REEL7
Manufacturer:
MICRON
Quantity:
543
AD8310
DIE INFORMATION
Table 7. Die Pad Function Descriptions
Pin No.
1
2
3
4
5A, 5B
6
7
8
Mnemonic
INLO
COMM
OFLT
VOUT
VPOS
BFIN
ENBL
INHI
Description
One of Two Balanced Inputs. Biased roughly to VPOS/2.
Common Pin. Usually grounded.
Offset Filter Access. Nominally at about 1.75 V.
Low Impedance Output Voltage. Carries a 25 mA maximum load.
Positive Supply. 2.7 V to 5.5 V at 8 mA quiescent current.
Buffer Input. Used to lower postdetection bandwidth.
CMOS Compatible Chip Enable. Active when high.
Second of Two Balanced Inputs. Biased roughly to VPOS/2.
BOND PAD STATISTICS
ALL MEASUREMENTS IN MICRONS
MINIMUM PASSIVATION OPENING: 92 × 92, MINIMUM PAD PITCH: 150
DIE SIZE CALCULATION
ALL MEASUREMENTS IN MICRONS
DIE X (WIDTH OF DIE IN X DIRECTION) = 745
DIE Y (WIDTH OF DIE IN Y DIRECTION) = 1390
DIE THICKNESS = 305
COORDINATES OF BOND PAD CENTERS:
(1) –233, +540 (2) –250, +310
(4) –250, –519 (5B) +250, –366 (5A) +250, –516
(6) +250, –218 (7) +249, +310
2
3
4
1
X
Figure 43. Die Outline Dimensions
Rev. F | Page 22 of 24
8
5B
5A
7
6
(3) –250, –273
(8) +233, +540
Y

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